Multi-Package Module IC System with Side Fan-In Interconnects
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Solution Overview
Problem
Current integrated circuit package systems face challenges in achieving high functional integration with minimal footprint and cost-effective manufacturing, as stacked-die-packaging and multi-package-modules often result in increased profile thickness, larger footprint, and complex fabrication methods, leading to higher production costs.
Innovation Solution
The integrated circuit package system employs a side fan-in-package-on-package structure with a first package and a second package mounted over an electrical interconnect array on a substrate, reducing the profile height and footprint by forming the second package adjacent to the first package substrate, simplifying the wire bonding process, and allowing for the use of thin and ultra-thin components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If stacked-die-packaging or stacked packaging techniques are used to minimize footprint area, then the footprint is reduced, but the profile height and package interconnections become limiting factors as circuit density increases
Solution Approach 1:
The patent transitions from vertical stacking (increasing height in one dimension) to lateral arrangement with side fan-in interconnections (utilizing horizontal plane and reducing reliance on vertical dimension). Packages are arranged adjacent to each other with interconnections entering from the side, effectively distributing the integration across two dimensions rather than compressing everything vertically.
2Adaptability or versatility
If multi-package-module techniques are used to improve circuit density and functional integration, then functional integration is improved, but profile thickness and footprint area increase
Solution Approach 1:
The system divides the integrated circuit functionality into multiple discrete packages, each containing specific devices or functions. These segmented packages are then interconnected through side fan-in connections, allowing functional integration while maintaining compact individual package profiles and enabling modular assembly.
3Quantity of substance
If multi-package-module techniques are used to improve circuit density, then circuit density is improved, but fabrication methods become complicated leading to increased production costs
Solution Approach 1:
Each package is prepared in advance with pre-formed interconnection structures and devices mounted and wired before final assembly. The side fan-in interconnections are established during individual package fabrication rather than requiring complex post-assembly routing, simplifying the overall manufacturing process while achieving high circuit density through efficient space utilization.
Data Source
AI summary
An integrated circuit package system that includes: providing a first package including a first package first device and a first package second device both adjacent a first package substrate; and mounting and electrically interconnecting a second package over an electrical interconnect array formed on a substrate of the first package second device.