IC Socket Single-Operation Loading Cam Mechanism
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Solution Overview
Problem
Conventional IC sockets require multiple operations to load IC packages and ensure electrical connection, with pressure application covers being unsuitable for LGA and BGA types, and the loading mechanism for PGA types applies load in an inappropriate direction.
Innovation Solution
An IC socket design featuring an insulation housing with elastic contacts, a load support member with guide grooves and a cam surface, a pressure application cover with a nail section that slides along the cam surface, and a lever that changes the pressure application cover's position between load and no-load positions, allowing for single-operation loading and secure electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pressure application cover with stoppers is used for LGA or BGA type IC packages, then the electrical connection between pads and contacts can be ensured, but the loading operation requires three separate steps (setting pressure application cover, manipulating first stopper, manipulating second stopper) which increases labor and time
Solution Approach 1:
The patent combines the pressure application cover setting operation and the stopper manipulation operations into a single integrated lever operation. When the lever is manipulated, it simultaneously sets the pressure application cover and manipulates both stoppers in one continuous motion, reducing the loading process from three separate steps to one step while maintaining reliable electrical connection.
Solution Approach 2:
The lever is designed to perform the pressure application cover setting action as a preliminary action before the stoppers engage. The lever's motion sequence automatically positions the pressure application cover first, then proceeds to manipulate the stoppers, ensuring proper preparation before final engagement without requiring separate operations.
2Ease of operation
If a lever sliding mechanism is used for PGA type IC packages, then the loading operation can be completed in a single step, but the load is applied in a direction unsuitable for IC sockets with pressure application covers, and the mechanism cannot ensure proper electrical connection for LGA and BGA types with shorter terminals
Solution Approach 1:
The lever mechanism is designed to perform multiple functions: it sets the pressure application cover, manipulates both stoppers, and applies pressure in the correct direction. This single lever operation is universally applicable to ensure proper electrical connection for LGA and BGA types while maintaining ease of operation, making the mechanism multi-functional rather than single-purpose.
Solution Approach 2:
The lever mechanism employs dynamic motion where the pressure application cover and stoppers are manipulated in a coordinated sequence during lever movement. The mechanism transitions from a static multi-step process to a dynamic single-step process where components move and engage in a predetermined sequence, ensuring proper loading and electrical connection.
3Ease of operation
If the mounting surface is slid by a lever in a PGA type socket, then loading is simplified to one operation, but the lever applies load to the insulation housing in a direction different from the pressing direction required for LGA and BGA types
Solution Approach 1:
The lever mechanism incorporates curved or inclined surfaces (cam surfaces) that convert the lever's rotational or linear motion into the correct directional pressure. The cam surfaces are shaped to guide the pressure application cover and stoppers in the proper direction, transforming the lever's motion into the required load direction for LGA and BGA types while maintaining single-operation simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient loading of IC packages with a minimal number of operations while ensuring reliable electrical connection between pads and contacts, and prevents damage to the IC package and insulation housing.
Implementation Method 1
a plurality of elastic contacts electrically connected to a substrate and provided corresponding to a plurality of pads disposed in a matrix manner on the lower face of the IC package
Implementation Method 2
both side walls rising from the base section along opposing side walls of the insulation housing and each provided with a guide groove with a cam surface; a pressure application cover positioned on an upper face side of the IC package, having a nail section sliding along the cam surface in the guide groove
Data Source
AI summary
There is provided an IC socket for an IC package having plural pads disposed in a matrix manner on the lower face thereof, on which the IC package can be loaded with a small number of operations, and after the loading, the electrical connection between the pads and contacts can be ensured. The IC socket includes: a load support member having both side walls each provided with guide grooves having cam surfaces; a pressure application cover changing position between a load position which applies load to an IC package thereby pressing the pads against elastic contacts and a no-load position, and having nail sections sliding along the cam surfaces in the guide grooves; a lever including a crankshaft section causing the nail sections to slide along the cam surfaces in the guide grooves thereby causing the pressure application cover to change position between the load position and the no-load position.