IC Socket Conductive Springs for Reliable High-Temperature Replacement

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Solution Overview

Problem

Conventional IC sockets face challenges in maintaining reliable electrical connections at high temperatures and are difficult to replace without causing contact failures, especially when used with non-heat-resistant circuit boards.

Innovation Solution

The IC socket design incorporates conductive connecting sections with holding sections for IC lead terminals and protruded conductive springs that are fixed closer to the circuit board, ensuring secure contact through elastic force, eliminating the need for soldering and allowing easy replacement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If soldering is used to connect the IC socket to the circuit board, then electrical conduction is established, but the replacement process becomes complicated and requires melting the solder again

Engineering Contradiction:

Improveelectrical conductionVSAvoidreplacement process

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The connection structure is segmented into two parts: a projection section that protrudes from the IC socket and a separate pad on the circuit board. This segmentation allows the IC socket to be connected without soldering, enabling easy removal and replacement by simply detaching the projection from the pad, while still maintaining reliable electrical conduction through direct contact.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent replaces the thermal-mechanical soldering process with a pure mechanical connection system. The projection section with elastic force mechanically engages with the pad, eliminating the need for solder melting and solidification. This mechanical substitution enables the IC socket to be easily removed and replaced without thermal processing, solving both the reliability and ease of operation requirements.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If the projection section is made elastic to ensure contact, then contact reliability improves, but manufacturing precision becomes more difficult to control

Engineering Contradiction:

Improvecontact reliabilityVSAvoidcontact evenness

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the physical parameter of the projection section by giving it elastic properties. This elastic parameter allows the projection to automatically adjust and maintain consistent contact with the pad, compensating for variations in manufacturing precision. The elastic deformation ensures that contact evenness is achieved through material property rather than strict dimensional control.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The elastic property of the projection section acts as a cushioning mechanism that anticipates and compensates for contact inconsistencies. By incorporating this elastic cushioning beforehand, the system ensures reliable contact even when manufacturing precision varies, as the elastic material absorbs and compensates for dimensional variations in the connection process.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Temperature

If a ceramic circuit board is used for high temperature resistance, then temperature resistance improves, but cost increases and size is limited

Engineering Contradiction:

Improvetemperature resistanceVSAvoidcost and size

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent replaces the thermal-mechanical soldering process with a mechanical connection system that does not require high temperature processing. This substitution allows the use of cost-effective, non-ceramic circuit boards with larger size capabilities, while the projection section's elastic force ensures reliable contact even under high temperature conditions without requiring the circuit board itself to be heat-resistant.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The IC socket with its projection section is designed as a replaceable component that can be easily removed and replaced. This approach allows the use of cheaper, non-ceramic circuit boards, accepting that the IC socket may need replacement over time rather than requiring expensive, permanent ceramic substrates for high temperature applications.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures reliable and consistent electrical connections by ensuring all springs make contact with the circuit board, reducing the likelihood of connection failures and allowing for easy replacement without welding, thus addressing the issues of high-temperature reliability and replacement complexity.

Implementation Method 1

plurality of conductive springs, which are protruded from the IC socket and respectively fixed to the conductive connecting sections, the conductive springs being closer to a circuit board than the conductive connecting sections

Methodology Applied

Scientific EffectElastic force: Elasticity

Data Source

PatentUS7311528B2IC socket

Publication Date: 2007.12.25 ESPEC CORP

AI summary

An IC socket comprises a plurality of conductive connecting sections each having a holding section for holding one of a plurality of lead terminals of an IC; and a plurality of conductive coil springs, which are protruded from the IC socket and respectively fixed to the conductive connecting sections, the conductive springs being closer to a circuit board than the conductive connecting sections.