IC Socket Contact with Multi-Spring Segmentation for High-Frequency Signals

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Solution Overview

Problem

Conventional contacts with two objects-to-contact face challenges in achieving high springiness while maintaining a short signal path length, leading to increased inductance and noise issues, especially with the increasing number of external contacts and decreasing pitch, making it difficult to design and manufacture contacts that are compatible with high-frequency signals and stable electrical connections.

Innovation Solution

The contact design features a support member with multiple spring portions and an engagement claw, allowing for high springiness and stable electrical contact with both the IC package and printed-wiring board, while being easily attachable to an IC socket, using a socket body with contact-receiving chambers and fitting grooves to accommodate the contact's vertical movement and secure fit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the contact length at the elastically deforming portion is increased to increase the contact spring constant, then the contact springiness is improved, but the signal path length increases resulting in increased inductance and noise

Engineering Contradiction:
Improvecontact spring constantVSAvoidsignal path length
Core Design Contradiction:
StrengthVSLength of stationary object

Solution Approach 1:

The contact structure transitions from a conventional linear arrangement to a three-dimensional configuration with multiple spring portions extending in different directions (first spring portion extending upward, second spring portion extending sideways, third spring portion extending downward, fourth spring portion extending sideways). This spatial arrangement achieves the required spring constant while maintaining a short signal path length between contact points, thereby resolving the contradiction between contact springiness and signal path length.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the contact size is reduced to accommodate decreasing pitch of external contacts, then the adaptability to high-density packaging is improved, but the contact springiness decreases making it difficult to maintain predetermined contact pressure

Engineering Contradiction:
Improvecontact sizeVSAvoidcontact springiness
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The contact is divided into multiple independent spring portions (first, second, third, and fourth spring portions) with distinct functional roles. This segmentation allows each portion to contribute to the overall spring constant while keeping the total contact size small. The multiple spring portions work together to provide sufficient contact pressure despite the reduced overall dimensions, resolving the contradiction between compact size and springiness.

Inventive Principle:
Principle #1Segmentation

3Reliability

If the contact structure is made complex to achieve high springiness with short signal path, then the electrical connection stability is improved, but the manufacturing time and complexity increase

Engineering Contradiction:
Improveelectrical connection stabilityVSAvoidcontact structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention optimizes geometric parameters of the spring portions (lengths, widths, thicknesses, and angles) to achieve the desired spring constant and electrical connection stability. By carefully controlling these parameters, the contact provides reliable electrical connections while maintaining a relatively simple single-piece structure that is easier to manufacture compared to multi-component designs, thus resolving the contradiction between connection stability and manufacturing complexity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves high springiness for stable electrical connections with reduced signal line length, ensuring compatibility with high-frequency signals and simplifying the manufacturing process by allowing easy attachment and fitting within the IC socket, while maintaining desired contact pressure.

Implementation Method 1

The first spring portion extends obliquely upper forwardly from an upper end of the support member... The second spring portion is bent from the first contact point of the first spring portion, to extend obliquely lower rearwardly... The third spring portion extends obliquely lower forwardly from a lower end of the support member... The fourth spring portion is bent from the second contact point of the third spring portion, to extend obliquely upper rearwardly

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS7621755B2Contact and IC socket using the contact
Publication Date: 2009.11.24 YAMAICHI ELECTRONICS CO LTD
  • US7621755B2 patent drawing
  • US7621755B2 patent drawing
  • US7621755B2 patent drawing

AI summary

A contact includes a support member, a first spring portion, a second spring portion, a third spring portion and a fourth spring portion. The first spring portion extends obliquely upper forwardly from an upper end of the support member and has, at an apex, a first contact point which contacts with an IC package. The second spring portion is bent from the first contact point, to extend obliquely lower rearwardly and have a first touch portion. The third spring portion extends obliquely lower forwardly from a lower end of the support member and has a second contact point which contacts with a printed-wiring board, thus being in contrast with the first spring portion with respect to the support member. The fourth spring portion is bent from the second contact point, to extend obliquely upper rearwardly and has a second touch portion for contacting with the first touch portion.