IC Socket Cover Assembly with Leaf Spring Actuation and Airflow Cavity
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Solution Overview
Problem
Existing IC socket cover designs face challenges in providing precise and uniform actuating forces while efficiently dissipating heat, due to their rigid and bulky construction which impairs force consistency and heat management.
Innovation Solution
The IC chip actuator cover assembly features a side-deployed actuator mechanism with spring-mounted leaf springs and a pedestal assembly for precise z-axis force application, combined with a carrier housing that allows air flow and accommodates cooling structures for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a threaded depressor construction is used in the socket cover, then the IC chip package can be depressed in a controlled z-axis movement, but the actuating force becomes rigid and bulky with frictional forces that impair precision and uniformity
Solution Approach 1:
The actuator mechanism is divided into separate functional components: a carrier housing, side-deployed actuating members, and a pedestal assembly with leaf springs. This segmentation allows each component to perform its specific function independently, eliminating the need for a single complex threaded depressor while improving force precision and reducing frictional interference.
2Temperature
If a bulky lid and depressor construction is used, then the IC chip package can be actuated, but the ability of the socket cover to carry away heat generated within the IC chip is limited
Solution Approach 1:
The actuating function is extracted from the traditional lid structure and relocated to side-deployed actuating members. This extraction allows the lid to be redesigned with open cavity regions and integrated heat dissipation structures, separating the actuation function from the thermal management function while improving overall heat dissipation capability.
Solution Approach 2:
The actuating members are deployed at the sides of the carrier housing rather than through the center, transitioning from a vertical z-axis actuation approach to a side-mounted approach. This dimensional change allows air flow openings to be provided in the front and back of the housing, enabling improved air circulation and heat dissipation through the central cavity region.
3Ease of operation
If actuating members are deployed at the center of the carrier housing, then the actuation mechanism is simplified, but the actuating force distribution becomes unbalanced and heat dissipation is impaired
Solution Approach 1:
The actuating members are positioned asymmetrically at the sides of the carrier housing rather than at the center, creating a balanced force distribution through the side leaf springs while simultaneously enabling central cavity regions for air flow. This asymmetric deployment resolves the conflict between simplified mechanism and improved heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves balanced and precise actuating forces with minimal deflection and improved heat dissipation capabilities, suitable for high-pin-count and high-power IC chip packages.
Implementation Method 1
The compliance of the leaf springs will maintain a constant and precise actuating force on the IC chip when the IC chip is contacted by the pusher end portion or portions of the pedestal assembly
Implementation Method 2
a carrier housing that allows air flow and accommodates cooling structures for enhanced heat dissipation
Implementation Method 3
accommodates cooling structures for enhanced heat dissipation
Data Source
AI summary
An improved IC chip actuator cover assembly for an IC socket includes a pedestal assembly spring-mounted to the bottom of a carrier housing and side leaf springs or other similar force transferring means on the pedestal assembly which transmit a z-axis force to the corner regions of the pedestal assembly for advancing the pedestal assembly in the z-axis direction against an IC chip in the IC socket. The compliance of the leaf springs maintains a constant and precise actuating force on the IC chip when the IC chip is contacted by the pusher end portion or portions of the pedestal assembly. In a preferred aspect of the invention, the front, back, and sides of the carrier housing define a central cavity region above the pedestal assembly for permitting air flow through the carrier housing to improve the heat dissipation capability of the cover assembly.