IC Inspection Socket With Direct Heating for High-Temperature Testing
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Solution Overview
Problem
Existing IC inspection devices struggle to efficiently inspect high-temperature performance without requiring dedicated high-temperature environments.
Innovation Solution
An IC inspection socket equipped with a pin block, floating plate, and a heating element that can heat the IC package directly, allowing inspection in a normal-temperature environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If dedicated high-temperature equipment is used to inspect high-temperature performance, then inspection accuracy for high-temperature performance is improved, but device complexity and inspection cost increase
Solution Approach 1:
The patent combines the heating function and inspection function into a single integrated socket device. The heating element is built into the socket itself, allowing the inspection device to generate its own high-temperature environment rather than requiring external high-temperature equipment. This merging eliminates the need for separate high-temperature rooms or chambers.
Solution Approach 2:
The inspection socket is designed to perform multiple functions: it can inspect IC packages at both normal temperature and high temperature using the same device. The heating element allows the socket to create different temperature conditions as needed, making the inspection device universal rather than requiring dedicated equipment for each temperature condition.
2Adaptability or versatility
If high-temperature rooms are used for inspection, then high-temperature performance inspection is enabled, but loss of time and inspection efficiency decrease
Solution Approach 1:
The heating element is pre-installed within the socket structure, ready to activate immediately when needed. This preliminary preparation eliminates the time required to transport IC packages to external high-temperature facilities or to set up separate heating equipment. The heating can begin instantly as part of the inspection process.
Solution Approach 2:
The heating element acts as an intermediary that creates the high-temperature environment directly at the inspection location. Instead of requiring the IC package to be placed in a distant high-temperature room, the heat is generated right where the inspection occurs, eliminating transportation and setup time.
3Adaptability or versatility
If heating element is added to the socket, then high-temperature inspection capability is improved, but device complexity increases
Solution Approach 1:
The heating element uses a flexible printed circuit board (FPC) as its substrate, which allows the heating component to be thin and adaptable to the socket structure. This flexible film-based approach minimizes the added complexity compared to rigid heating elements, and the FPC can be easily integrated into the existing socket design.
Solution Approach 2:
The heating element's temperature can be controlled by adjusting electrical parameters (voltage, current) supplied to the FPC heating traces. This allows precise temperature control without requiring complex mechanical or structural adjustments to the socket, maintaining relative simplicity while achieving versatile temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-temperature performance inspection without the need for high-temperature facilities, while preventing temperature drop and ensuring efficient heat transfer.
Implementation Method 1
a heating element configured to heat the IC package, in which the heating element is configured to be in contact with the IC package
Data Source
AI summary
An IC inspection socket includes: a pin block including a plurality of contact probes; a floating plate configured to guide the IC package to be inspected; and a heating element configured to heat the IC package, in which the heating element is configured to be in contact with the IC package.