IC Socket Heat Sink Mechanism for Low-Impact Package Contact
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Solution Overview
Problem
Existing heat sink units for IC packages during burn-in tests suffer from damage to the IC package due to tilting and impact during operation, occupy excessive space, and limit access directions, resulting in scratches, chips, and inefficient heat dissipation.
Innovation Solution
A heat sink unit with a rockable frame member and levers that restrict further rocking at a confronting position, allowing the heat sink to vertically move downward and contact the IC package, reducing impact and space usage while maintaining high radiating efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the heat sink is operated in contact and non-contact by the operation of arms along an arc trajectory, then the heat sink can be opened and closed, but the heat sink tilts and comes into contact with the IC package from the end portion, causing damage such as scratches or chips
Solution Approach 1:
Instead of having the heat sink contact the IC package from the end portion during closing operation, the invention inverts the contact mechanism so that the bottom surface of the heat sink base contacts the IC package when the frame member is in the horizontal position. This prevents tilting damage by ensuring uniform contact across the base surface rather than point contact at the end portion.
Solution Approach 2:
The invention applies preliminary anti-action by using a lever mechanism that restricts further rocking of the frame member when it reaches the horizontal position. This prevents the heat sink from tilting and contacting the IC package at the end portion, thereby preventing damage before it can occur during the closing operation.
2Productivity
If the operation speed in the process of closing the heat sink is fast, then the operation is efficient, but the heat sink might damage the IC package due to the impact when it is closed
Solution Approach 1:
The invention implements beforehand cushioning by using a lever mechanism that provides gradual deceleration as the frame member approaches the horizontal position. The lever restricts further rocking motion, creating a cushioning effect that reduces impact speed before the heat sink contacts the IC package, thereby preventing impact damage while maintaining efficient operation.
3Temperature
If a plurality of heat sinks are installed, then the heat dissipation capacity is increased, but the space occupied by the heat sink units is increased
Solution Approach 1:
The invention merges the functions of multiple heat sinks into a single integrated heat sink unit that contacts the IC package through a frame member mechanism. This consolidates the heat dissipation function into one compact unit, maintaining effective heat dissipation capacity while reducing the overall mounting area compared to installing multiple separate heat sinks.
Solution Approach 2:
The frame member serves multiple functions: it supports the heat sink, provides the opening and closing motion, ensures proper positioning, and protects the IC package from damage. This multi-functionality allows a single heat sink unit to achieve what would otherwise require multiple separate components, reducing the mounting area while maintaining heat dissipation effectiveness.
4Adaptability or versatility
If the heat sink is opened in two or more directions in the open state, then the heat sink can be accessed from multiple directions, but the directions of access to the socket and the heat sink unit are limited to the upper surface and two directions or less
Solution Approach 1:
The invention uses a dynamic frame member that can rock between a horizontal position (for heat dissipation) and an upward tilted position (for access). This dynamic positioning allows the heat sink to be accessed from various directions when opened, while maintaining the ability to provide effective heat dissipation when closed, thereby improving adaptability without permanently limiting access directions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat sink unit provides a compact design with high radiating efficiency, preventing damage to the IC package and enhancing access flexibility during the burn-in test process.
Implementation Method 1
the heat of the IC package is transferred from the base to a cooling fin, and the heat is dissipated from the cooling fin
Implementation Method 2
an attachment-type heat sink unit surrounding it may be used together
Data Source
AI summary
The present invention provides a heat sink unit that has a small mounting area and high radiating efficiency without breaking or damaging the IC package. The heat sink unit includes a base, a heat sink, a unit base, a heat sink mount, a frame member, a first lever, and a second lever. When the frame member 6 reaches a confronting position, further rocking is restricted, the heat sink mount supported by the frame member moves downward, and the end surface of the heat sink supported by the heat sink mount comes into contact with the IC package.