IC Socket Housing with Embedded Metal Mesh for Thermal Management

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Solution Overview

Problem

High-power integrated circuits (ICs) face significant thermal management challenges due to increasing power densities and heat transfer issues, leading to pin temperature rises that can cause damage to socket materials and deformation, especially in high-performance applications like gaming and video processing.

Innovation Solution

The development of an IC socket with a high thermal conductivity dielectric housing and embedded metal mesh structures that facilitate heat transfer from pins to an outer metal frame, combined with thermal grease or gel for improved heat dissipation and a high-k underfill for lateral heat transfer, effectively managing thermal loads and preventing material degradation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If high-power ICs are used to increase performance, then processing capability is improved, but pin temperature rises causing material damage

Engineering Contradiction:

ImproveIC power consumptionVSAvoidpin temperature

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent introduces a dielectric material with high thermal conductivity as an intermediary substance between the socket pins and the housing. This dielectric acts as a thermal mediator that conducts heat away from the pins while maintaining electrical insulation, thereby resolving the contradiction between high power operation and temperature control

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite materials combining dielectric properties with high thermal conductivity. The housing structure integrates metallic components for heat dissipation with dielectric materials for electrical insulation, creating a composite system that manages both thermal and electrical requirements simultaneously

Inventive Principle:

Principle #40Composite materials

2Reliability

If socket housing materials are used to insulate pins, then electrical insulation is improved, but heat dissipation deteriorates

Engineering Contradiction:

Improveelectrical insulationVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent uses composite materials that combine dielectric properties with high thermal conductivity. The housing structure integrates metallic components for heat dissipation with dielectric materials for electrical insulation, creating a composite system that manages both thermal and electrical requirements simultaneously

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the thermal conductivity parameter of the dielectric material by selecting materials with exceptionally high thermal conductivity values. This parameter change allows the dielectric to maintain its electrical insulation function while dramatically improving its heat dissipation capability

Inventive Principle:

Principle #35Parameter changes

3Area of moving object

If pin density is increased to reduce form factor, then area is reduced, but thermal management becomes more difficult

Engineering Contradiction:

Improvesocket areaVSAvoidthermal management

Core Design Contradiction:

Area of moving objectVSTemperature

Solution Approach 1:

The high thermal conductivity dielectric material acts as a thermal intermediary that efficiently conducts heat away from densely packed pins. This mediator enables effective thermal management in high-density configurations by providing dedicated thermal pathways for each pin or group of pins

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the thermal management approach by providing individual or localized thermal pathways for different pin groups. The housing structure is designed with segmented heat dissipation zones that correspond to the pin density distribution, allowing independent thermal management of different regions

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly reduces pin temperature and prevents damage to socket materials by efficiently channeling heat away from the pins, ensuring reliable operation of high-power ICs in dense packaging configurations.

Implementation Method 1

embedded metal mesh structures that facilitate heat transfer from pins to an outer metal frame

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

combined with thermal grease or gel for improved heat dissipation

Methodology Applied

Scientific EffectHeat dissipation: Conduction (thermal)

Implementation Method 3

and a high-k underfill for lateral heat transfer

Methodology Applied

Scientific EffectLateral heat transfer: Conduction (thermal)

Data Source

PatentUS11581671B2Integrated circuit package socket housing to enhance package cooling

Publication Date: 2023.02.14 INTEL CORP

AI summary

An integrated circuit (IC) socket comprising a housing with a land side, an opposing die side, and sidewalls around a perimeter of the housing. The housing comprises a first dielectric. A plurality of socket pins extends from the land side of the housing through socket pin holes in the housing over the die side of the housing. A second dielectric is within the interstitial regions between the socket pins and sidewalls of the socket pin holes. A frame structure extends around at least a portion of the perimeter of the housing, and a mesh structure is embedded within the first dielectric. The mesh structure has plurality of mesh filaments extending between the plurality of socket pin holes and coupled to the frame structure.