IC Socket Lid Mechanism for Image Sensor Dust Protection
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Solution Overview
Problem
During burn-in tests, image sensors face the risk of contamination and damage due to foreign matters adhering to their photodetection surfaces, especially in high-temperature environments, and existing IC sockets may distort or damage photodetection elements by pressing on the upper surfaces.
Innovation Solution
An IC socket design featuring a lid member that covers the back surface of the image sensor without contact, using a sliding cover mechanism and a biasing mechanism to maintain the lid in a closed position, preventing dust adhesion and allowing easy opening and closing to attach and detach the image sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the image sensor is placed on a seat with the photodetection surface facing upward for testing, then the contact portion can be easily connected to the inspection substrate, but foreign matters such as dust and contamination can adhere to the photodetection surface during the test
Solution Approach 1:
A lid member is provided that can cover the photodetection surface of the image sensor. The lid member acts as a protective barrier that prevents dust and contamination from adhering to the photodetection surface during burn-in tests while allowing the sensor to remain accessible for connection and testing operations.
2Strength
If the upper surface of the image sensor is pressed to secure it to the socket, then the sensor can be firmly fixed, but the photodetection elements may cause distortion or damage
Solution Approach 1:
The pressing force is applied locally to the back surface of the image sensor package rather than the upper surface with the photodetection elements. The lid member covers and protects the photodetection surface area, allowing securing pressure to be applied to the package body without transmitting force to the sensitive photodetection elements.
3Device complexity
If the photodetection surface is provided on the upper surface of the image sensor, then the sensor structure is simplified, but the photodetection elements are vulnerable to damage from direct pressing or contamination
Solution Approach 1:
The lid member serves as an intermediary protective element between the external environment and the photodetection surface. It provides physical protection against contamination and damage while allowing the photodetection surface to remain on the upper surface for simplified sensor structure and optical access.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents dust adhesion on the photodetection surface of image sensors, ensuring performance integrity by maintaining the lid in a closed position and allowing for easy operation of the socket.
Implementation Method 1
a lid member that does not come into contact with the image sensor and that covers a back surface region located on a side of a back surface of the image sensor
Implementation Method 2
a biasing mechanism that biases the lid member so as to cover the back surface region
Data Source
AI summary
Provided is an IC socket for a semiconductor capable of preventing adhesion of dust to a photodetection surface provided on an opposite side of a contact surface of an image sensor with no contact with the photodetection surface. The IC socket for a semiconductor includes: a seat (12) that has an attachment surface (12a) to which an image sensor (60) is attached; a base (10) that has a placement surface (10b) on which the seat (12) is placed and a secured surface (10a) located on an opposite side of the placement surface (10b) and secured to an inspection substrate; and a lid member (18) that does not come into contact with the image sensor (60) and that covers a back surface region (80) on a side of a back surface (64) of the image sensor (60) when the image sensor (60) is attached to the seat (12).