IC Socket Metal Plate Depression Damper
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Solution Overview
Problem
Conventional IC sockets face challenges in miniaturization due to the complexity of incorporating dampers, such as springs, to reduce the pressing force on electronic components, which is exacerbated by molding errors leading to increased distance between the socket cover and the component.
Innovation Solution
The electronic component socket employs a metal plate with a depression formed by bending, parallel to the rotation shaft, to provide a damper function without additional components like springs, allowing elastic deformation to suppress the pressing force on the IC package, and a locking mechanism to maintain the closed state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a damper such as a spring is provided between the socket cover and the heat dissipating member to suppress pressing force, then the pressing force on the electronic component is reduced, but the structure of the IC socket becomes complicated and space is consumed
Solution Approach 1:
The patent combines the damper function with the socket cover itself by forming a depression in the metal plate, merging two previously separate functions (cover and damper) into a single integrated component, thereby reducing structural complexity while maintaining the pressing force suppression capability
Solution Approach 2:
The patent changes the physical parameter of the socket cover by creating a depression with specific geometric characteristics (tapered shape, opening area increasing from bottom to opening) in the metal plate, which alters the mechanical properties to provide damping effect without requiring additional components
2Force
If a damper such as a spring is provided to suppress pressing force, then the pressing force on the electronic component is reduced, but the IC socket becomes difficult to miniaturize due to space requirements
Solution Approach 1:
The damper function is merged into the socket cover structure itself through the depression in the metal plate, eliminating the need for separate damper components and their associated space, thereby enabling miniaturization while maintaining pressing force control
Solution Approach 2:
The depression in the metal plate is designed with specific dimensional parameters (tapered shape, controlled opening area) that provide the necessary damping effect within the compact space of the miniaturized socket structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the socket to exert a damper function with a simple structure, reducing manufacturing complexity and cost, while effectively managing pressing force variations due to molding errors, even in miniaturized forms.
Implementation Method 1
The metal plate has a depression formed by bending along a line parallel to a rotation shaft of the socket cover in the vicinity of an area that receives a force from the pressing means
Data Source
AI summary
An IC socket includes: a socket main body having an accommodating part for accommodating an IC package; a socket cover having a one-side end portion pivotally supported by the socket main body, and the other-side end portion which is located opposite to the one-side end portion and lockable to the socket main body; and a heat dissipating member mounted on the socket cover and caused to press the IC package. The socket cover includes a metal plate extending from the one-side end portion to the other-side end portion so that the thickness direction of the metal plate is parallel to the direction in which the socket cover faces the accommodating part when the other-side end portion is locked to the socket main body. The metal plate has a depression formed by bending the metal plate.