IC Socket Temperature Sensor Air Gap Thermal Isolation

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Solution Overview

Problem

Conventional sockets for electrical components, such as IC sockets, face inaccuracies in temperature sensing due to heat emission from heat transfer members affecting temperature sensors through solid portions of insulation materials.

Innovation Solution

A socket design featuring a heat transfer member with an opening for a rod-like temperature sensor, where the sensor's tip end portion contacts the electrical component while being spaced apart from the heat transfer member by an air layer, reducing heat transfer and improving sensing accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a heat insulation material is interposed between the temperature sensor and the heat transfer member, then the thermal effect on the temperature sensor is reduced, but heat can still be transferred through solid portions of the insulation material causing temperature sensing errors

Engineering Contradiction:
Improvetemperature sensing accuracyVSAvoidheat interference from heat transfer member
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces air as an intermediary substance between the temperature sensor and heat transfer member. By forming an air layer through the recess structure, heat transfer via conduction is minimized since air has low thermal conductivity, thereby reducing thermal interference while maintaining sensor functionality

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies local quality by creating a recess structure specifically at the position where the temperature sensor contacts the heat transfer member. This localized modification introduces an air layer only at the critical interface, providing thermal insulation precisely where needed without affecting other functional areas

Inventive Principle:
Principle #3Local quality

2Device complexity

If the temperature sensor is placed in direct contact with the heat transfer member, then temperature measurement is simplified, but the sensor is affected by heat emitted from the heat transfer member causing measurement errors

Engineering Contradiction:
Improvesensor arrangement simplicityVSAvoidtemperature measurement accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The patent modifies the heat transfer member by creating a recess at the specific location where the temperature sensor makes contact. This localized structural change introduces an air layer interface without fundamentally altering the overall direct-contact configuration, maintaining simplicity while improving measurement accuracy

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The recess structure creates an air layer that acts as a thermal intermediary between the sensor and heat transfer member. This air medium reduces direct thermal conduction while allowing the sensor to remain positioned at the contact interface, preserving measurement functionality while reducing thermal interference

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the accuracy of temperature sensing by minimizing heat transfer between the heat transfer member and the temperature sensor, leading to more precise temperature readings of the electrical component.

Implementation Method 1

the tip end portion is spaced apart from the heat transfer member by an air layer in a state in which the tip end portion is in contact with the electrical component

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS10476220B2Socket for electrical component
Publication Date: 2019.11.12 ENPLAS CORP
  • US10476220B2 patent drawing
  • US10476220B2 patent drawing
  • US10476220B2 patent drawing

AI summary

An IC socket includes: a heat transfer member attached to a socket body in a manner capable of contacting an electrical component and having an opening penetratingly formed at a contact surface that contacts the electrical component accommodated in the socket body; and a temperature sensor that is mounted in the opening of the heat transfer member and has a rod-like tip end portion including a thermosensitive element and extending toward the electrical component, in which the tip end portion, as well as the heat transfer member, contacts the electrical component. In the IC socket, a tubular component having an insertion hole in which an outer surface of a portion of the temperature sensor other than the tip end portion is fitted in a slidable manner in the axial direction of the temperature sensor, is attached to the opening.