IC Test Socket Cover With Suction Picking for Fast Device Removal
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Solution Overview
Problem
Existing IC test sockets face challenges in efficiently removing and replacing IC devices without damaging them, especially when using improper tools, which can affect testing throughput and device integrity.
Innovation Solution
An IC test socket with an integrated IC picking mechanism that uses a plunger and resilient member to generate suction, allowing for easy attachment and detachment of IC devices without separate tools, ensuring secure handling and efficient testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If an IC test socket uses a separate tool for removing IC devices, then the device can be removed, but the testing throughput is reduced and the risk of device damage increases
Solution Approach 1:
The patent combines the IC picking mechanism directly into the cover member of the test socket, merging two previously separate functions (testing and device removal) into a single integrated system. This eliminates the need for separate external tools and enables automated device handling, thereby improving testing throughput while maintaining ease of operation.
2Productivity
If an IC test socket uses an integrated picking mechanism, then the ease of operation improves and testing throughput increases, but the device complexity increases
Solution Approach 1:
The picking mechanism is merged into the cover member structure, sharing common components such as the plunger assembly and resilient member. This integration approach adds functionality while minimizing the increase in overall device complexity by reusing existing structural elements rather than adding completely separate subsystems.
3Ease of operation
If improper tools are used to remove IC devices, then the removal can be performed, but the risk of device damage increases
Solution Approach 1:
The suction-based picking mechanism acts as an intermediary between the operator and the IC device, providing controlled and uniform force distribution across the device package. This eliminates the need for direct manual handling or use of improper tools that could concentrate stress on specific points, thereby preventing device damage while maintaining ease of removal.
4Device complexity
If manual handling methods are used for IC device removal, then the process is simple, but the testing throughput is reduced
Solution Approach 1:
The integrated picking mechanism enables the test socket to perform device removal automatically as part of the testing process. The plunger-driven suction system can be actuated by the testing apparatus itself, allowing the socket to serve its own device handling needs without requiring external manual intervention, thereby improving testing throughput while maintaining reasonable complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates quick and reliable removal and replacement of IC devices, enhancing testing throughput and reducing the risk of damage, while improving the lifespan of the socket and ensuring consistent testing processes.
Implementation Method 1
The cover member further includes a plunger movable in the through-aperture to change an atmospheric pressure inside the through-aperture to control a suction that retains the IC device to the cover member
Data Source
AI summary
An integrated circuit (IC) device test socket has an integrally formed IC picking mechanism for removing an IC device from the test socket after testing. The test socket has a base member and a cover member. The base member includes a recess that is configured to receive an IC device for testing. The cover member is configured to removably engage the base member to secure the IC device between the cover member and the base member. The cover member includes an IC picking mechanism configured to use suction to retain the IC device to the cover member.