IC Spatial Variation Estimation via Regression Analysis

Solution Overview

Problem

Traditional integrated circuit design methods require extensive resource consumption and high costs to generate accurate spatial variation models, either through direct measurement or referencing similar design conditions, which are not accurate enough due to changing design requirements.

Innovation Solution

A mathematical regression analysis method is used to interpolate or extrapolate spatial variation data, calculating slope values and regression coefficients to estimate process variations under different design conditions, reducing the need for extensive measurement and manufacturing time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If direct measurement of spatial variation model is performed under multiple design conditions, then measurement precision is improved, but loss of time and manufacturing cost increase significantly

Engineering Contradiction:

Improvespatial variation model accuracyVSAvoidflow time

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The patent performs preliminary measurement of spatial variation models under a limited set of design conditions (first and second design conditions) and stores this data. When a third design condition requires estimation, the system uses regression analysis on the pre-measured data to quickly generate the required spatial variation model without performing time-consuming direct measurements under all possible conditions.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces a regression analysis model as an intermediary between the measured spatial variation data and the required estimation. This mathematical model serves as a mediator that processes the limited measurement data and generates accurate estimates for unmeasured design conditions, eliminating the need for direct physical measurement under each condition.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If direct measurement of spatial variation model is performed under multiple design conditions, then measurement precision is improved, but manufacturing cost increases significantly

Engineering Contradiction:

Improvespatial variation model accuracyVSAvoidresource consumption

Core Design Contradiction:

Measurement precisionVSLoss of substance

Solution Approach 1:

The patent performs preliminary measurement of spatial variation models under a limited set of design conditions (first and second design conditions) and stores this data. When a third design condition requires estimation, the system uses regression analysis on the pre-measured data to quickly generate the required spatial variation model without performing time-consuming direct measurements under all possible conditions.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces a regression analysis model as an intermediary between the measured spatial variation data and the required estimation. This mathematical model serves as a mediator that processes the limited measurement data and generates accurate estimates for unmeasured design conditions, eliminating the need for direct physical measurement under each condition.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Loss of time

If reference to similar design condition is made, then loss of time is reduced, but measurement precision deteriorates due to design condition changes

Engineering Contradiction:

Improveflow timeVSAvoidspatial variation model accuracy

Core Design Contradiction:

Loss of timeVSMeasurement precision

Solution Approach 1:

The patent uses regression analysis to model the relationship between spatial variation and design condition parameters (voltage, temperature, channel length, etc.). By fitting a mathematical model to the measured data, the system can accurately estimate spatial variation for any design condition by plugging in the parameter values, rather than simply referencing similar conditions. This allows for accurate extrapolation beyond the measured range.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20250013814A1Estimation method used in integrated circuit chip of integrated circuit design and integrated circuit chip

Publication Date: 2025.01.09 REALTEK SEMICON CORP

AI summary

A method of an integrated circuit chip, includes: calculating a first slope of distance-to-spatial relation under first design condition according to spatial distance difference between two circuit elements within integrated circuit chip and a spatial process variation under first design condition; calculating a second slope of the distance-to-spatial relation under a second design condition according to the spatial distance difference and a spatial process variation under second design condition; calculating a ratio coefficient and an exponential coefficient according to the first slope, the second slope, a global process variation under the first design condition, and a global process variation under the second design condition; calculating a third slope of the distance-to-spatial relation under a third design condition according to the ratio coefficient and the exponential coefficient; and estimating a spatial process variation under the third design condition according to the third slope and the spatial distance difference.