Integrated Circuit Stack Cooling Layer Design
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Solution Overview
Problem
Current integrated circuit stacks face challenges in efficiently cooling high-performance processors with non-uniform heat distribution, particularly due to increased thermal resistance and limited space for convective heat removal between layers, which hampers their performance and efficiency.
Innovation Solution
The integration of a cooling layer with a non-uniform flow pattern, utilizing guide elements, funnel structures, and varying channel widths and grid densities between circuit layers to direct cooling fluid flow according to heat generation areas, enhancing heat transfer and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple circuit layers are stacked vertically to increase integration density, then circuit integration and signal path length are improved, but thermal resistance increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from planar cooling to three-dimensional interlayer cooling by placing cooling channels between stacked circuit layers. This vertical arrangement allows heat to be removed from multiple surfaces of each layer, effectively adding a third dimension to the heat dissipation pathway and reducing thermal resistance in high-density stacks.
Solution Approach 2:
The cooling system is segmented into multiple independent cooling channels, with each channel dedicated to cooling a specific circuit layer. This segmentation allows optimized cooling for each layer's thermal profile and enables parallel heat removal pathways, reducing overall thermal resistance.
2Ease of manufacture
If uniform cooling channels are used between circuit layers, then manufacturing is simplified, but heat transfer efficiency decreases due to non-uniform heat generation patterns
Solution Approach 1:
The cooling channel geometry is varied locally to match the heat generation pattern of each circuit layer. Areas with higher heat generation receive enhanced cooling through narrower channels or closer spacing, while lower heat generation areas use wider channels. This local optimization maintains manufacturing feasibility while significantly improving heat transfer efficiency.
Solution Approach 2:
The patent varies geometric parameters of the cooling channels (width, height, spacing) to optimize heat transfer. By changing these parameters according to the thermal load distribution, the system achieves efficient cooling without requiring complete redesign of the manufacturing process.
3Reliability
If cooling channels are placed closer to high heat generation areas, then heat transfer is improved, but available space for electrical interconnects and signal paths is reduced
Solution Approach 1:
The circuit layer is segmented into functional regions, with cooling channels positioned in interconnect regions or along the periphery rather than occupying the central active circuit area. This segmentation allows high heat transfer coefficients near heat-generating components while preserving sufficient area for electrical interconnects and signal paths.
Solution Approach 2:
The patent utilizes the vertical dimension by placing cooling channels in the gaps between stacked layers rather than competing for horizontal space within a single layer. This three-dimensional arrangement enables close proximity cooling without reducing the planar area available for circuits.
4Device complexity
If conventional single-phase liquid cooling is used in stacked modules, then system complexity is reduced, but cooling efficiency is insufficient for high-performance processors
Solution Approach 1:
The patent employs phase change materials or two-phase cooling mechanisms where the cooling fluid undergoes phase transitions (liquid to vapor and back) to absorb and remove heat. This phase change process provides significantly higher heat transfer coefficients than single-phase cooling, enabling efficient thermal management for high-performance processors while maintaining relatively simple system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves cooling performance by adapting fluid flow to match heat generation patterns, reducing the temperature gradient across the circuit layers and optimizing heat dissipation, thereby enhancing the operational efficiency and reliability of high-performance integrated circuit stacks.
Implementation Method 1
at least one cooling layer arranged in a space between the first and second circuit layer for cooling at least the first circuit layer using a cooling fluid
Implementation Method 2
the conductive thermal resistance is increased with each additional component or circuit layer
Implementation Method 3
a means for creating a non-uniform flow pattern for the cooling fluid in the hollow space resulting in a higher heat transfer in the first area than in the second area
Data Source
AI summary
The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for configuring of such an integrated circuit stack (1) by optimizing a configuration of the cooling layer (3).