IC Packaging with Stacking Structure for Known-Good-Die Testing
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in miniaturization, high packaging density, and flexible stacking configurations, leading to inefficiencies and assembly defects due to limited input/output capabilities and the difficulty in testing individual die before assembly.
Innovation Solution
The proposed integrated circuit packaging system involves an integrated circuit die with an active and passive side, connected by an inner bond wire to a contact pad, which is then molded within a stacking structure that exposes the passive side and top side, forming a cavity, allowing for flexible stacking and improved testing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional multi-chip modules are used to reduce board space, then packaging density is improved, but assembly process yield deteriorates due to inability to test individual die before assembly
Solution Approach 1:
The patent enables preliminary testing of individual die before they are assembled into multi-chip modules. By exposing bond pads on the die surface and providing test access structures, the system allows die to be tested individually for known-good-die identification prior to assembly, thereby improving assembly process yield while maintaining high packaging density
2Reliability
If die are individually tested and assembled using known-good-die approach, then assembly process yield is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the test structure with the functional circuitry of the die, integrating test access into the manufacturing process flow. This merging allows die to be tested during or after fabrication without requiring separate complex test equipment or additional assembly steps, thereby improving assembly process yield while minimizing manufacturing complexity
3Adaptability or versatility
If leaded packages are used for stacking, then packaging flexibility is improved, but input and output capabilities are limited
Solution Approach 1:
The patent transitions from traditional leaded package I/O to a wire bond-based I/O architecture. By using wire bonds extending from the die surface through the package, the system provides multiple input and output channels in a three-dimensional configuration, thereby increasing I/O capabilities while maintaining stacking flexibility through vertical package arrangements
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit die having an active side and a passive side; providing a contact pad having a top side oriented in a same direction as the passive side; connecting an inner bond wire to the contact pad and the integrated circuit die; and molding a stacking structure around the contact pad, the inner bond wire, and the integrated circuit die with the passive side and the top side exposed, and the stacking structure having a top structure surface on top and adjacent to or below the integrated circuit die, and a horizontal member under the integrated circuit die and forming a cavity.