Dual-Layer IC Substrate for Heat Dissipation
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Solution Overview
Problem
Integrated circuit (IC) die packaging faces challenges with heat dissipation due to encapsulation, which can lead to catastrophic failures and long-term degradation, especially when multiple IC dies are stacked, as the majority of heat dissipation occurs through limited connections and substrates without exposed heat spreaders or sinks.
Innovation Solution
A substrate with a heat conducting portion and a thicker heat dissipating portion is used, where the heat conducting portion is thin to maintain a compact form factor and the heat dissipating portion is positioned externally to facilitate efficient heat dissipation into the environment, with electrical connections passing through openings in the substrate to connect flip-chip dies mounted on opposing sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If IC dies are stacked and encapsulated in a compact package, then the form factor is reduced and integration is improved, but heat dissipation becomes insufficient leading to reliability degradation
Solution Approach 1:
The substrate is designed with a dual-layer structure where the first substrate layer handles electrical connections and the second substrate layer provides heat dissipation pathways. This dimensional separation allows the package to maintain a compact form factor while incorporating dedicated heat dissipation structures that extend the thermal management functionality into a separate layer, effectively resolving the contradiction between compact size and heat dissipation capability
Solution Approach 2:
The substrate is segmented into functionally distinct layers: a first substrate layer for electrical interconnection and a second substrate layer for heat dissipation. This segmentation allows each layer to be optimized for its specific function - the first layer for signal integrity and the second layer for thermal management - thereby achieving both compact packaging and effective heat dissipation without compromise
2Adaptability or versatility
If multiple IC dies are stacked to increase functionality, then device capability is improved, but heat dissipation paths become more limited and temperature rises
Solution Approach 1:
The second substrate layer acts as an intermediary thermal management structure between the stacked IC dies and the external environment. This intermediate layer provides dedicated heat dissipation pathways that intercept and conduct heat away from the dies before it can accumulate, thereby enabling multiple dies to be stacked for enhanced functionality while maintaining acceptable operating temperatures through the mediating thermal conduction role of the second substrate layer
3Length of stationary object
If a thin substrate is used to maintain compact form factor, then packaging efficiency is improved, but heat dissipation capability is reduced
Solution Approach 1:
The solution transitions from relying on a single thin substrate layer for both electrical and thermal functions to a dual-layer substrate structure. The first substrate layer remains thin for electrical connections while the second substrate layer is specifically designed with enhanced thickness and thermal conductivity for heat dissipation. This dimensional differentiation allows the overall package to maintain compact form factor while the second layer compensates for the limited heat dissipation capacity of the thin first layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat generated by IC dies, reducing the risk of failure and maintaining a thin form factor while ensuring efficient heat dissipation into the environment, even in stacked configurations.
Implementation Method 1
a first portion suitable for conducting heat captured from the dies
Implementation Method 2
a second portion integrally formed with the first portion, the second portion suitable for dissipating the heat conducted by the first portion into the environment surrounding the integrated circuit package assembly
Data Source
AI summary
An integrated circuit package includes a substrate having a heat conducting portion integrally formed with a heat dissipating portion. First and second integrated circuit dies are mounted to opposite sides of the heat conducting portion of the substrate. The first and second integrated circuit dies may each be packaged as flip-chip configurations. Electrical connections between contact pads on the first and second integrated circuit dies may be formed through openings formed in the heat conducting portion of the substrate. The heat dissipating portion may be positioned externally from a location between the first and second integrated circuit dies so that it dissipates heat away from the integrated circuit package into the surrounding environment.