IC Substrate Support Inlays for Sub-150 μm Pitch Integration

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing integrated circuit (IC) substrates face challenges in achieving a compact and reliable design with high functionality, particularly due to the need for smaller pitch and increased miniaturization of components.

Innovation Solution

The proposed solution involves an integrated circuit substrate with a support structure having at least one hole, where at least two functional inlays are placed side by side within the hole, achieving a pitch of not more than 150 μm at the integrated circuit component mounting side.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional approaches are used to form component carriers, then manufacturing simplicity is maintained, but pitch cannot be reduced below conventional limits and functionality is limited

Engineering Contradiction:

ImprovepitchVSAvoidstructure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The support structure is divided into multiple segments or layers, allowing functional inlays to be placed at different levels and positions. This segmentation enables achieving small pitch (≤150 μm) by distributing components across multiple segments rather than requiring all connections on a single plane, thus resolving the contradiction between manufacturing precision and device complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from two-dimensional planar arrangements to three-dimensional spatial arrangements by placing functional inlays inside holes at different depths and positions within the support structure. This dimensional change allows achieving small pitch requirements while maintaining manufacturing feasibility through vertical stacking and multi-level integration.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If pitch is reduced to achieve compact design, then miniaturization is achieved, but mechanical robustness and electrical reliability become more difficult to maintain

Engineering Contradiction:

Improvesubstrate sizeVSAvoidelectrical reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

Functional inlays are nested inside holes within the support structure, creating a compact three-dimensional arrangement. This nesting approach achieves miniaturization by utilizing the internal volume of the substrate rather than only the surface area, while maintaining reliability through proper embedding and protection of functional elements within the robust support structure.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The support structure is formed as a composite material system combining the substrate material with embedded functional inlays. This composite approach maintains mechanical robustness while achieving compact size, as the support structure provides structural integrity while accommodating miniaturized functional elements within its matrix.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS20250038117A1IC substrate with support structure and functional inlays therein

Publication Date: 2025.01.30 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

An integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the integrated circuit substrate comprises a support structure having at least one hole, and at least two functional inlays placed inside said at least one hole side by side, wherein a pitch at an integrated circuit component mounting side of the integrated circuit substrate is not more than 150 μm.