IC Package Substrate Layout for Warpage and Short Prevention

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Solution Overview

Problem

Integrated circuit (IC) packages face challenges in maintaining circuit reliability due to substrate thinning requirements, which can lead to warpage and increased risk of electron migration and electrical shorting.

Innovation Solution

A substrate design for IC packages that incorporates a core layer made of glass material for stabilization, along with an adjacent insulation layer and embedded metal structures positioned to avoid electron migration. The embedded metal structures are positioned at least a certain length from the core layer surface to prevent electrical shorting, and shorter vias are used to connect the metal structures through the core layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If metal structures are positioned closer to the core layer to reduce package height, then package height is reduced, but electron migration risk increases leading to electrical shorts

Engineering Contradiction:

Improvepackage heightVSAvoidelectrical short prevention

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

An insulation layer is introduced as an intermediary between the metal structure and the core layer. This insulation layer physically separates the metal structure from the core layer, preventing electron migration while allowing the metal structure to be positioned closer to the core layer, thus reducing package height without compromising electrical safety

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The substrate employs a composite structure combining the core layer, insulation layer, and metal structure in a multi-material configuration. This composite approach allows each material to fulfill its specific function while working together to achieve both compact dimensions and high reliability

Inventive Principle:

Principle #40Composite materials

2Length of stationary object

If core layer thickness is reduced to meet package height requirements, then package height is reduced, but warpage control becomes difficult

Engineering Contradiction:

Improvepackage heightVSAvoidsubstrate warpage

Core Design Contradiction:

Length of stationary objectVSStability of the object's composition

Solution Approach 1:

The thickness of the core layer is optimized to a specific range (5-20 micrometers) to balance package height reduction with warpage control. By precisely controlling the core layer thickness parameter and compensating through the insulation layer, the substrate achieves compact dimensions while maintaining dimensional stability and minimizing warpage

Inventive Principle:

Principle #35Parameter changes

3Reliability

If insulation layer thickness is increased to prevent electron migration, then electrical short prevention is improved, but package height increases

Engineering Contradiction:

Improveelectron migration preventionVSAvoidpackage height

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The insulation layer thickness is optimized to a specific range (2-10 micrometers) that provides sufficient electrical isolation to prevent electron migration while minimizing the increase in package height. This parameter optimization ensures both reliability and compact dimensions are achieved simultaneously

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20250062203A1Substrate(s) for an integrated circuit (IC) package employing a core layer and an adjacent insulation layer(s) with an embedded metal structure(s) positioned from the core layer

Publication Date: 2025.02.20 QUALCOMM INC

AI summary

A substrate includes a core layer and one or more metallization layers. The core layer provides stabilization to the substrate to reduce or avoid warpage. The core layer may include a glass material weaved throughout the core to provide stabilization and avoid warpage. A metallization layer adjacent to the core layer in the substate includes an insulation layer and the embedded metal structure(s) that is positioned from the core layer. The thickness of the insulation layer is greater than the embedded metal structure so that a surface of the embedded metal structure is positioned at least at a length from the surface of the glass material. This can avoid or reduce the risk of the embedded metal structure electrically shorting to another metal structure in the substrate through the core layer.