Integrated Circuit Support Structure with Embedded Circuit Elements
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices with integrated circuit dies face mechanical support issues due to the thinness of the dies, which is insufficient for providing adequate structural integrity, and rely on silicon carrier dies without circuit elements for support.
Innovation Solution
Incorporating a support structure with a thickness of at least 110 microns, which includes circuit elements such as capacitors, inductors, or voltage regulators, and conductors like through-substrate vias or bond pads to provide both mechanical support and additional functionality between integrated circuit dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thin integrated circuit dies are used, then device size is reduced, but mechanical support and structural integrity are insufficient
Solution Approach 1:
The patent merges the support structure with functional circuit elements into a single integrated component. The support structure includes capacitors, inductors, voltage regulators, and other circuit elements that are electrically coupled to the integrated circuit dies, allowing the support structure to simultaneously provide mechanical support and perform electrical functions.
Solution Approach 2:
The support structure is designed to serve multiple functions: it provides mechanical support for the thin integrated circuit dies, performs electrical functions through integrated circuit elements, and enables signal and power distribution. This multi-functionality eliminates the need for separate carrier dies that only provide mechanical support.
2Strength
If traditional silicon carrier dies without circuit elements are used, then mechanical support is provided, but device functionality is limited
Solution Approach 1:
The patent combines mechanical support functions with electrical circuit functions in a single support structure. Circuit elements such as capacitors, inductors, voltage regulators, and signal processing circuits are integrated into the support structure, allowing it to simultaneously provide mechanical support and perform multiple electrical functions.
Solution Approach 2:
The support structure serves as both a mechanical carrier and an active circuit component. It provides structural support while also performing functions such as power regulation, signal processing, and data storage, thereby enhancing device versatility without requiring additional separate components.
3Adaptability or versatility
If support structure with circuit elements is implemented, then device functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent integrates multiple functions into a single support structure that can be manufactured as one unified component. The support structure includes circuit elements, conductors, and mechanical support features all formed in an integrated manner, reducing the need for separate assembly steps and multiple discrete components.
Solution Approach 2:
The support structure is designed with distinct functional regions that can be independently optimized and manufactured. Different areas of the support structure can contain different circuit elements or perform different functions, allowing for modular design and simplified manufacturing of complex multi-functional structures.
Data Source
AI summary
An electronic device includes a first integrated circuit die, a support structure, and a second integrated circuit die and may include a spacer. The support structure includes a circuit element. The support structure has a thickness of at least 110 microns. The spacer or second integrated circuit die includes a conductor. The spacer or second integrated circuit die is disposed between the first integrated circuit die and the support structure. The conductor is electrically coupled to the integrated circuit die or the circuit element of the support structure. The electronic device provides more flexibility to a designer by allowing a circuit element or circuit that occupies a significant area to be in the support structure.