IC Support Structure for Solder Bump Reliability

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Solution Overview

Problem

Modern integrated circuit package systems face challenges with manufacturing reliability and performance due to issues like solder bump miniaturization, internal stresses, and material differences, leading to problems such as delamination, contamination, and intermittent failures, which existing technologies have not adequately addressed.

Innovation Solution

The introduction of a ring-shaped, smaller-than-paddle, and larger-than-paddle integrated circuit supports made of non-conductive materials with high thermal characteristics, providing uniform spacing and support between the integrated circuit die and leadframe, and designed to prevent solder bump collapse and ensure consistent electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If solder bump size is reduced to achieve miniaturization, then footprint and package size are reduced, but mechanical robustness and joint reliability deteriorate

Engineering Contradiction:

Improvepackage sizeVSAvoidjoint robustness

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent introduces a support structure positioned between the integrated circuit die and leadframe that provides mechanical reinforcement to solder bumps before they can collapse or fail. This preventive support cushioning effect compensates for the reduced mechanical strength of miniaturized solder bumps, allowing small solder joints to maintain reliability despite their reduced size and increased susceptibility to mechanical failure.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Adaptability or versatility

If different packaging materials are used to meet diverse requirements, then functionality and performance are improved, but internal stresses and delamination risks increase

Engineering Contradiction:

Improvematerial compatibilityVSAvoidinternal stress

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent employs a support structure made from materials with thermal expansion coefficients matched to the surrounding packaging materials (such as epoxy or ceramic). This material homogeneity in thermal characteristics reduces differential thermal stresses that would otherwise cause delamination or structural failure, enabling the use of diverse functional materials while maintaining overall structural stability during temperature cycling.

Inventive Principle:

Principle #33Homogeneity

3Productivity

If manufacturing processes are simplified to reduce costs, then productivity increases, but manufacturing precision and reliability control decrease

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidreliability control

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The support structure is pre-formed as a separate component before final assembly, with precise dimensions and material properties already established. This preliminary preparation allows the support to be integrated into the packaging process as a standardized element, maintaining manufacturing precision through pre-controlled fabrication while simplifying the overall assembly process and improving productivity through reduced on-site manufacturing complexity.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS7420265B2Integrated circuit package system with integrated circuit support

Publication Date: 2008.09.02 STATS CHIPPAC LTD

AI summary

An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.