Embedded IC Tag Antenna Pattern Selection for Relay Manufacturing
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Solution Overview
Problem
Existing methods for manufacturing products with IC tags are limited by the need to prepare multiple tags with different frequency bands for various shipping destinations and communication ranges, leading to increased manufacturing costs and extended production times.
Innovation Solution
A method involving a molded resin element with an embedded IC chip and printed antenna wiring, where the antenna pattern is determined and formed based on shipping destination and usage environment, allowing for quick production of products with selected antenna patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple IC tags with different frequency bands are prepared for various shipping destinations, then the adaptability to different countries is improved, but the manufacturing cost increases
Solution Approach 1:
The patent creates a universal IC tag structure where a single antenna can be reconfigured to operate at different frequency bands (860-960 MHz and 2400-2500 MHz) through software control of varactor diodes. This multi-functional antenna design eliminates the need to manufacture separate IC tags for different countries, reducing manufacturing complexity while maintaining adaptability to various frequency regulations.
Solution Approach 2:
The patent changes the electrical parameters of the antenna by varying the capacitance of varactor diodes through voltage control. By adjusting the bias voltage applied to the varactor diodes, the resonant frequency of the antenna can be dynamically changed to match different country-specific frequency bands, allowing a single physical tag to adapt to multiple operational conditions without requiring multiple manufacturing variants.
2Adaptability or versatility
If multiple IC tags with different frequency bands are prepared in advance, then the frequency matching for shipping destinations is improved, but the production time increases
Solution Approach 1:
The patent introduces dynamic frequency adjustment capability to the IC tag through voltage-controlled varactor diodes. The antenna's resonant frequency can be dynamically changed after manufacturing by adjusting the control voltage, allowing the same physical tag to be adapted to different frequency bands based on the shipping destination. This dynamic adaptability eliminates the need for static pre-configured tags for each country, significantly reducing production time while maintaining frequency matching capability.
Solution Approach 2:
The patent performs preliminary configuration of the frequency band by setting the appropriate control voltage for the varactor diodes during the ordering or shipping process, rather than during manufacturing. This allows the physical IC tags to be produced in advance in a universal configuration, and the specific frequency band is activated later based on the destination requirements, separating manufacturing from configuration and thus reducing production time.
3Ease of manufacture
If the IC chip is exposed on the surface, then the antenna connection is simplified, but the mechanical stress resistance deteriorates
Solution Approach 1:
The patent embeds the IC chip within a molded resin structure, nesting the chip inside the housing rather than exposing it on the surface. The antenna is configured to connect to the embedded chip through openings or pathways in the resin structure. This nesting approach protects the fragile IC chip from mechanical stress and damage while maintaining electrical connectivity for antenna operation, resolving the contradiction between ease of connection and mechanical reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid manufacturing of products with IC tags having adaptable antenna patterns, reducing inventory needs and production time while preventing fraudulent activities by embedding the IC chip within the resin element.
Implementation Method 1
an antenna wiring 13 formed on the outer surface of the molded resin element 11 and configured for an IC chip to perform wireless communication
Implementation Method 2
The IC chip making up the IC tag is extremely susceptible to mechanical stress, and breaks easily. Thus, Japanese Patent Publication No. 2008-210344 (Patent Document 3) discloses technology for embedding the entire IC tag in a resin or rubber material to protect the IC chip.
Data Source
AI summary
A method of manufacturing a relay includes a molded resin element step configured to produce a molded resin element with an IC chip is embedded therein by injecting a resin around the IC chip; an assembly step configured to apply the molded resin element to a base material as an exterior jacket component of the relay, the base material serving as the main body of the relay; and an antenna wiring forming step configured to print an antenna wiring on a surface of the molded resin element, the antenna wiring configured to allow the IC chip to perform wireless communication.