IC Tag Protective Layer Modulus Design for Repeated Bending
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
IC tags are prone to damage from external forces like bending, leading to degraded communication performance, particularly in applications requiring durability against repeated washing or drying, such as laundry tags.
Innovation Solution
The IC tag design includes a substrate with a tensile modulus of 0.8 to 8 GPa and a protective layer with a tensile modulus defined within specific ranges relative to the substrate's modulus, using dielectric resins like acrylic-based and epoxy-based thermosetting resins, to enhance bending resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin protective layer is added to protect the antenna, then the antenna is protected from environmental damage, but the resin may peel off when subjected to repeated bending forces
Solution Approach 1:
The patent applies parameter changes by carefully controlling the tensile modulus values of both the substrate and protective layer within specific ranges. The substrate tensile modulus is set between 0.01×Y² and Y×0.4, and the protective layer tensile modulus is set between 0.03 and Y×0.6 (where Y is the protective layer's tensile modulus). This parameter optimization ensures the materials have appropriate flexibility and bonding strength to resist peeling under repeated bending while maintaining protection functionality.
Solution Approach 2:
The patent employs composite materials by combining a substrate made of plastic or paper with a resin protective layer. This composite structure integrates the mechanical properties of different materials - the substrate provides structural support while the resin layer provides environmental protection, creating a synergistic system that balances protection and flexibility.
2Strength
If the substrate and protective layer are made with appropriate tensile moduli, then bending resistance is improved, but material selection becomes more constrained
Solution Approach 1:
The patent defines specific mathematical relationships for tensile modulus parameters to optimize bending resistance. The substrate tensile modulus X must satisfy 0.01×Y² ≤ X ≤ Y×0.4, and the protective layer tensile modulus Y must satisfy 0.03 ≤ Y ≤ 0.6×Y (where Y is the protective layer's tensile modulus). These parameter specifications provide clear design guidelines that balance performance requirements with manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves bending resistance, preventing peeling and damage to the antenna, ensuring reliable communication performance under repeated mechanical stress.
Implementation Method 1
a step of forming a protective layer along the IC chip and the antenna on the substrate by heating and pressing the resin material
Data Source
AI summary
Provided are an IC tag and a manufacturing method therefor which are capable of preventing an antenna from being damaged even when the IC tag is repeatedly subjected to external forces such as bending. The IC tag includes: an IC chip; an antenna that electrically transmits and receives information stored in the IC chip; a sheet-like substrate that supports the IC chip and the antenna; and a resin protective layer which is a dielectric covering the IC chip and the antenna between the resin protective layer and the substrate, in which a tensile modulus [GPa] of the substrate and a tensile modulus [GPa] of the protective layer are defined within an area surrounded by five lines represented by the following formulas (1), (2), (3), (4), and (5), with the tensile modulus of the substrate on an X-axis and the tensile modulus of the protective layer on a Y-axis.X=0.8(1)X=8(2)Y=0.03(3)Y=X0.4(4)Y=0.01×X2(5)