IC Tag Curved Covering Boundary for Stress Distribution
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Solution Overview
Problem
IC tags attached to linen goods face breakage due to stress concentration at the boundary between thicker and thinner covering regions when subjected to external forces during washing, leading to potential bending, breakage of the antenna part, film member, or separation of the covering.
Innovation Solution
An IC tag design featuring a film member with an antenna part and IC chip, where the covering is thicker over the IC chip and thinner elsewhere, with a curved boundary configuration to distribute stress and prevent repeated bending at a single location, and optional protruding portions to reduce stress on the IC chip and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the covering is made thicker to protect the IC chip and connection from external forces, then the strength and protection capability is improved, but the flexibility of the IC tag deteriorates
Solution Approach 1:
The covering is designed with different thicknesses in different regions: a first thickness in the first region (over the IC chip and connection) and a second thickness in the second region (over the antenna part), where the first thickness is greater than the second thickness. This local differentiation allows the covering to provide enhanced protection where needed while maintaining flexibility in other areas.
2Strength
If the covering thickness is increased uniformly across the entire IC tag, then the protection against external forces is improved, but the flexibility and bendability of the IC tag deteriorates
Solution Approach 1:
The covering thickness is locally optimized by making the first region (over the IC chip) thicker than the second region (over the antenna part). This allows the IC tag to have sufficient overall flexibility while achieving protection of the portion of connection of the IC chip and the antenna part by relatively thick covering.
3Ease of manufacture
If the covering has a straight boundary between thick and thin regions, then the manufacturing is simplified, but stress concentration occurs at the boundary leading to bending and breakage
Solution Approach 1:
The boundary between the first region and the second region of the covering is configured to be curved rather than straight. This curved configuration prevents stress concentration at the boundary that would occur with a straight line, thereby preventing bending and breakage of the IC tag when external forces are applied.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the IC tag by preventing breakage while maintaining overall flexibility and protecting the IC chip and antenna connection from external forces.
Implementation Method 1
a covering (140, 141) made of an elastic material that covers at least a side of the film member (110) on which the IC chip (130) is mounted
Data Source
Figure 1(a)~1(c)
Figure 2~3
Figure 4
AI summary
The invention prevents, with improved reliability, an IC tag from being broken, while ensuring overall flexibility of the IC tag. The IC tag 100 is provided with a covering 140 made of an elastic material, which covers at least the side of the IC tag 100 on which an IC chip 130 is mounted and has a thickness that is larger in its portion 140a that covers a region about the IC chip 130 than in its portion 140b that covers a region outside the region about the IC chip 130. The covering 140 is configured in such a way that at least a part of a boundary of the portion 140a of the covering that covers the region about the IC chip 130 and the portion 140b of the covering that covers the region outside the region about the IC chip 130 has a curved shape.