IC Tag Protective Sheet Protrusion Design
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Solution Overview
Problem
IC tags used in severe environments are prone to separation of the IC chip from the antenna due to external forces like bending, leading to communication failure.
Innovation Solution
An IC tag design featuring a base sheet with an IC chip and antenna, covered by a protective sheet with a protruding portion and bonded using a thermosetting resin, and an elastically-deformable support sheet to absorb deformation and prevent separation during bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the IC chip is mounted directly on the base sheet without additional protective structures, then the manufacturing process is simple, but the IC chip separates from the antenna when external force such as bending is applied
Solution Approach 1:
The protective sheet is segmented into a flat portion and a protruding portion, where the protruding portion specifically targets the IC chip area. This segmentation allows the protective sheet to provide focused support to the IC chip without requiring complex manufacturing processes, resolving the contradiction between manufacturing simplicity and attachment reliability.
Solution Approach 2:
The protective sheet introduces a vertical dimension by protruding upward at the IC chip location. This dimensional change creates a physical barrier and support structure that prevents the IC chip from separating from the antenna during bending, while maintaining a simple planar manufacturing approach.
2Reliability
If a protective sheet with protruding portion is added to prevent IC chip separation, then the reliability is improved, but the device structure becomes more complex
Solution Approach 1:
The protective sheet applies local quality by having different configurations in different areas: a flat portion for general protection and a protruding portion specifically at the IC chip location. This localized approach provides enhanced reliability where needed without adding unnecessary complexity to the entire structure.
Solution Approach 2:
The protective sheet is made from a single resin material that provides both structural support and protective functions. This use of composite functionality within a single material layer achieves the desired reliability without increasing structural complexity through multiple separate components.
3Object-affected harmful factors
If the protective sheet is made thicker to provide better protection, then the protective performance is improved, but the flexibility and ability to absorb bending deformation is reduced
Solution Approach 1:
The protective sheet is designed as a thin film structure (25-250 μm thickness) that maintains flexibility while providing protection. The protruding portion configuration allows this thin film to adapt to bending deformations without compromising protective performance, resolving the contradiction between protection and flexibility.
Solution Approach 2:
The protective sheet is designed to be dynamically adaptable during bending operations. The protruding portion can deform and move with the IC chip during bending, providing continuous protection while accommodating the dynamic changes in shape and position that occur during flexing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents IC chip separation from the antenna even under external forces such as bending, ensuring continuous communication.
Implementation Method 1
a protective sheet that is fixed to the first surface of the base sheet via a bonding agent
Implementation Method 2
the bonding agent can be made of a thermosetting resin
Implementation Method 3
arranging an elastically-deformable support sheet on the protective sheet
Implementation Method 4
a vacuum press can be used in the pressing of the protective sheet
Data Source
AI summary
An IC tag according to the present invention includes: a base sheet having a first surface and a second surface; an IC chip arranged on the first surface of the base sheet; an antenna that is arranged on the first surface of the base sheet and is configured to electrically transmit and receive information stored in the IC chip; and a protective sheet that is fixed to the first surface of the base sheet via a bonding agent, so as to cover the IC chip and the antenna. The protection sheet has a protruding portion that protrudes along the IC chip.