IC Tag Mounting Member With Resin Head for Orientation-Free Fastening
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Solution Overview
Problem
Existing IC tag mounting structures are costly due to time-consuming processes and have restrictions on mounting direction, limiting productivity and flexibility.
Innovation Solution
A mounting member with an IC tag featuring a metal shaft-shaped portion, a disk-shaped base portion with a chamfered outer surface, and a resin head portion that seals the IC tag, allowing for easy manufacturing and flexible mounting directions without directivity restrictions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the IC tag is incorporated in the head portion of the bolt using the conventional method with housing portion, filler, and resin coating layer, then the IC tag is protected and sealed, but the manufacturing process becomes time-consuming and costly with poor productivity
Solution Approach 1:
The patent merges the sealing function and IC tag housing into a single integrated resin head portion. The resin head is molded to directly cover and seal the IC tag mounted on the base portion, eliminating the need for separate housing portions, filler materials, and multiple coating steps. This integration maintains reliable sealing while dramatically simplifying the manufacturing process.
Solution Approach 2:
The resin head portion serves multiple functions simultaneously: it acts as the mounting base for the IC tag, provides sealing protection, forms the functional head of the bolt, and integrates the locking mechanism. This multi-functionality consolidates what were previously separate components into a single element, improving both productivity and reliability.
2Strength
If the bolt is made of metal to provide structural strength, then the mounting member has mechanical strength, but communication directivity is introduced requiring precise mounting orientation
Solution Approach 1:
The patent employs a composite structure where the shaft portion is made of metal for mechanical strength while the head portion is made of resin for electromagnetic transparency. This material differentiation allows the mounting member to maintain structural integrity through the metal shaft while enabling omnidirectional IC tag communication through the resin head, eliminating communication directivity restrictions.
3Reliability
If multiple separate components (housing portion, filler, lid, resin coating layer) are used to protect the IC tag, then the IC tag is well-protected, but the number of manufacturing steps increases making the process complex and costly
Solution Approach 1:
The patent combines multiple protective functions into a single resin head portion that is molded directly over the IC tag. This eliminates the need for separate housing portions, filler materials, lids, and resin coating layers, reducing the component count from four separate elements to one integrated structure while maintaining comprehensive protection.
Solution Approach 2:
The IC tag is mounted on the base portion before the resin head is molded, allowing the tag to be positioned and secured in advance. The resin head is then molded to encapsulate and protect the pre-positioned IC tag, combining the mounting and sealing operations into a single molding step that reduces overall manufacturing complexity.
Data Source
AI summary
Provided is a mounting member with an IC tag, the mounting member being easily manufactured and configured so as to not have constraints in terms of attachment orientation. The mounting member with an IC tag is provided with: a shaft-shaped section 1 having a shaft-shaped insert part 11 and a base part 12 which is formed by one end section of the insert part 11 protruding in the width direction; an IC tag 2 fixed to a surface 123 of the base part 12; and a resin head part 3 which is molded to at least the surface 123 side of the base part 12 so as to seal the IC tag 2. Male threads are preferably formed on the insert part 11.


