Calibrating Integrated Circuit Temperature Sensors Using Transient Decay Slopes
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Solution Overview
Problem
Conventional methods for calibrating temperature sensors in semiconductor devices are slow due to the large thermal mass of thermal chambers and PCB assemblies, resulting in long equilibration times, typically taking around 30-60 minutes.
Innovation Solution
A method utilizing a calibrated external temperature sensor to quickly calibrate an internal temperature sensor by measuring temperature slopes and differences, allowing for faster thermal equilibration and calibration of integrated circuit temperature sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional steady-state calibration method using thermal chamber is used, then temperature sensor calibration accuracy is achieved, but calibration time becomes very long (30-60 minutes)
Solution Approach 1:
The patent extracts the temperature sensor from the large thermal mass environment (thermal chamber) and places it in a small thermal mass environment (package with die). This allows the sensor to be calibrated in situ within the actual operating environment, eliminating the need for large thermal chamber equilibration while maintaining calibration accuracy through the use of a reference temperature sensor on the same die.
Solution Approach 2:
The patent changes the calibration approach from steady-state temperature measurement to transient temperature measurement. By measuring temperature slopes (dT/dt) during transient heating or cooling, the system can determine calibration parameters without waiting for thermal equilibrium, dramatically reducing calibration time while maintaining accuracy through mathematical processing of transient data.
2Stability of the object's composition
If thermal chamber with large thermal mass is used for calibration, then uniform ambient temperature can be achieved, but equilibration time to reach temperature set point becomes very large
Solution Approach 1:
The patent removes the temperature sensor calibration from the large thermal mass thermal chamber environment and performs it in situ within the small thermal mass package. This extraction eliminates the bottleneck of large thermal mass equilibration while the use of a reference sensor and slope measurement techniques compensates for the smaller thermal mass by providing accurate relative temperature measurements during transient states.
3Ease of manufacture
If package with thermal mass is used for sensor mounting, then mechanical support and electrical connection are provided, but thermal equilibrium between package and ambient temperature is slow
Solution Approach 1:
The patent performs calibration during the manufacturing process before the package is finalized and before it undergoes subsequent assembly steps. By calibrating the temperature sensor in situ within the package during manufacturing, the system captures the calibration data before the package's thermal mass becomes a constraint in later operational phases, eliminating the need for post-assembly calibration waits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces calibration time, enabling faster production and easier calibration during assembly, while maintaining accurate temperature sensor calibration.
Implementation Method 1
a calibrated temperature sensor positioned externally to an integrated circuit in a package to calibrate a temperature sensor in the integrated circuit
Implementation Method 2
allowing the integrated circuit and the package to thermally equilibrate over a first period of time
Implementation Method 3
sensing a first slope of a temperature decay by the first temperature sensor. The method may include sensing a second slope of a temperature decay by the second temperature sensor
Data Source
AI summary
In some embodiments, a method may be provided for calibrating integrated circuit temperature sensors. The method may include sensing a first temperature using a first temperature sensor and a second temperature using a second temperature sensor. The first temperature sensor may be calibrated and is external to a package of the integrated circuit. The second temperature sensor may be included in the integrated circuit. The method may include increasing a temperature of the integrated circuit. The method may include allowing the integrated circuit and the package to thermally equilibrate over a first period of time. The method may include sensing a first slope of a temperature decay by the first temperature sensor. The method may include sensing a second slope of a temperature decay by the second temperature sensor. The method may include calibrating the second temperature sensor responsive to a difference between the first and second temperatures and the first and second slopes.