Integrated Circuit Temperature Sensor and Identification
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Solution Overview
Problem
Conventional methods for temperature measurement in integrated circuits, such as image sensors, are cumbersome and inefficient, as they require additional space and components, and do not account for device-specific temperature sensitivities, leading to potential damage and performance degradation.
Innovation Solution
A single integrated circuit incorporating both device-identification and temperature-sensing features without additional bond pads or package pins, utilizing a diode-connected transistor and temperature sensor diode in parallel, with an opaque layer to prevent photocurrent generation, allowing for simultaneous identification and temperature monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal couple is mounted on the package to measure temperature, then temperature monitoring capability is improved, but the area occupied increases and integration becomes more complex
Solution Approach 1:
The patent merges the temperature sensor function with the existing pixel array by forming a photodiode temperature sensor within the same physical structure. The temperature sensor shares the package area with the image sensor pixels, eliminating the need for separate thermal couples and reducing overall area occupation while maintaining temperature monitoring capability.
Solution Approach 2:
The photodiode structure serves dual functions: it acts as both an image sensor pixel for capturing optical images and as a temperature sensor for measuring local temperature. This multi-functionality allows a single structure to perform both imaging and temperature sensing without requiring additional dedicated components.
2Reliability
If a thermal couple is mounted on the package to measure temperature, then temperature monitoring capability is improved, but the cost and complexity of integration increase
Solution Approach 1:
The patent merges the temperature sensor function with the existing pixel array by forming a photodiode temperature sensor within the same physical structure. The temperature sensor shares the package area with the image sensor pixels, eliminating the need for separate thermal couples and reducing overall area occupation while maintaining temperature monitoring capability.
Solution Approach 2:
The existing pixel array structure is utilized to serve dual purposes - both imaging and temperature sensing. The photodiodes that would normally only capture light are instead used to sense temperature through their temperature-dependent electrical characteristics, making the system self-sufficient without requiring external temperature sensing components.
3Adaptability or versatility
If device identification feature is added to integrated circuit, then device-specific optimization capability is improved, but the circuit complexity increases
Solution Approach 1:
The device identification is achieved through passive resistive heating patterns that are inherently produced by the device itself during normal operation. The heating pattern serves as a unique fingerprint that identifies the device type without requiring active identification circuits or additional components, thereby avoiding increased circuit complexity while enabling device-specific optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and device-specific temperature monitoring, preventing overheating damage and improving image quality by allowing for optimized settings and algorithms, while minimizing modifications to existing electronics.
Implementation Method 1
an opaque layer covering at least the temperature sensor to prevent photocurrent generation therein
Implementation Method 2
the device-identification circuit comprises a resistor connected to a diode-connected transistor; the temperature sensor may be a diode connected in parallel with the device-identification circuit
Data Source
AI summary
Both a device-identification feature and a temperature-sensor feature are combined on a single integrated circuit. In various embodiments, both features are not operative simultaneously.