IC Test Socket Floating Hinge Uniform Pressing Force
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Solution Overview
Problem
Existing clamshell type-socket devices for testing integrated circuits (ICs) often damage the ICs due to uneven pressing forces, especially when the number of leads increases and the ICs are subjected to high temperatures during burn-in tests, as they can scratch the upper surface of the ICs during loading.
Innovation Solution
A socket device with a floating hinge block and latch system, utilizing camshafts and elastic members to adjust the height of the hinge and latch, ensuring a uniform pressing force across the entire upper surface of the IC, and incorporating a heating unit for temperature control, allowing for even contact and preventing damage during loading and testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a fixed hinge block and fixed latch are used in the clamshell type-socket device, then the structure is simple, but the pressing force is uneven and damages the IC
Solution Approach 1:
The patent applies the dynamics principle by making the hinge block and latch float rather than being fixed. The floating hinge block (210) and floating latch (220) can move vertically to adjust their positions, allowing the pressing portion to apply uniform pressing force across the IC surface. This dynamic adjustment capability resolves the contradiction by enabling uniform pressing (improving reliability) while maintaining relatively simple structure (through elastic members and camshafts rather than complex active control systems).
Solution Approach 2:
The patent applies parameter changes by modifying the vertical position parameters of the hinge block and latch through camshaft rotation. As the camshaft rotates, the cam surface profile changes the vertical position of the floating hinge block and latch, thereby adjusting the pressing force distribution. This allows transformation from fixed position (causing uneven pressing) to variable position (achieving uniform pressing), resolving the technical contradiction.
2Adaptability or versatility
If the number of IC leads is increased, then the testing capability is improved, but the required pressing force increases and causes damage
Solution Approach 1:
The patent applies local quality by distributing the pressing force uniformly across different locations of the IC surface through the floating mechanism. Instead of concentrated pressing that damages leads, the floating hinge block and latch system distributes the force locally across multiple contact points, enabling testing of ICs with increased lead counts without causing damage to individual leads.
3Force
If a powerful pressing device is used, then the contact force is sufficient, but the IC surface is scratched during loading
Solution Approach 1:
The patent applies beforehand cushioning by using elastic members (springs) to support the floating hinge block and latch. These elastic members provide a cushioning effect that allows the pressing device to apply sufficient contact force while preventing surface scratching through the compliant, shock-absorbing nature of the elastic support system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures that the IC is pressed with a uniform force, preventing damage and allowing for stable electrical contact, even as the number of leads increases, and enables testing at appropriate temperature conditions, enhancing the reliability of the IC testing process.
Implementation Method 1
a floating hinge block elastically supported on a side of the base in a vertical direction
Implementation Method 2
camshafts interlocking with a rotational motion of a handle unit to adjust heights of the floating hinge block and the floating latch
Implementation Method 3
incorporating a heating unit for temperature control
Data Source
AI summary
Disclosed is a socket device for testing an IC, the socket device including: a base on which an integrated circuit (IC) is mounted; a contact module having multiple contacts; a floating hinge block elastically supported on a side of the base in a vertical direction; a lid configured to rotate with the floating hinge block and having a pressing portion on a bottom surface thereof; a floating latch elastically supported on a side of the base to be parallel to the floating hinge block such that the lid is fixed; a first camshaft installed by penetrating the base and the floating hinge block and adjusting a height of the floating hinge block; a second camshaft installed by penetrating the base and the floating latch and adjusting a height of the floating latch; a lever; a handle; and a link connected to the lever and the handle respectively to rotate independently.