IC Test Socket Inversion for Sensor Access
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing test systems for integrated circuits require complex conversions and specialized handling for sensor device testing, which is inefficient and not easily adaptable for different IC housing types, and often necessitate the use of measuring cards within the test unit.
Innovation Solution
A test system with a manipulation device and a test unit, where the integrated circuit is inserted 'flipped' into a socket, allowing for direct electrical connection and sensor testing without the need for additional handling or measuring cards, utilizing a coupling device and gas-tight gas chamber for comprehensive testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the integrated circuit is inserted with the underside down into the socket (conventional orientation), then the electrical connection contacts are easily contacted, but the sensor device on the top side cannot be accessed for testing
Solution Approach 1:
The patent inverts the conventional IC insertion orientation by placing the IC with its top side (sensor side) facing up in the socket, allowing the sensor device to be accessed and tested by the test unit while maintaining electrical connection through the socket's design
2Adaptability or versatility
If a specialized manipulation device with sensor testing capability is developed, then sensor device testing becomes possible, but the device complexity and conversion cost increase
Solution Approach 1:
The test unit is designed with multi-functionality to perform both conventional electrical parameter measurements and sensor device testing through integrated test programs, eliminating the need for separate specialized manipulation devices while maintaining comprehensive testing capability
Solution Approach 2:
The test system utilizes the existing manipulation device infrastructure and adds testing capability through software control and integrated test programs in the test unit, allowing the system to serve itself without requiring complex hardware modifications to the manipulation device
3Measurement precision
If measuring cards are installed in the test unit for sensor testing, then sensor functions can be measured, but the device complexity and setup time increase
Solution Approach 1:
The patent merges the sensor testing functionality directly into the test unit's integrated circuit holder and test program structure, combining electrical parameter measurement and sensor testing into a single unified process without requiring separate measuring cards or additional hardware components
4Adaptability or versatility
If the IC is transported on its back (flipped orientation), then the sensor device is accessible for testing, but the handling process becomes more complex
Solution Approach 1:
The socket and test system are designed to accommodate and normalize the flipped IC orientation, making the top-side-up position the standard operating state rather than an exception, thereby simplifying sensor accessibility while maintaining ease of operation through proper system design
Data Source
AI summary
The test system (10) has a test unit (30), and a manipulation device (20) that is provided with a receiving unit (40) with a socket (50). A packaged integrated circuit (60) is accommodated in the socket and is provided with a top side (62) and a bottom side (64), where multiple electrical terminal contacts (70) are formed on the bottom side. An electrical connection is formed between the socket and the terminal contacts. A sensor device is arranged on the top side of the integrated circuit, where the top side of the integrated circuit is oriented in a direction of the test unit. The electrical terminal contacts are electrically connected to the receiving unit of the manipulation device. An elastic sealing lip (92) is formed between a gas chamber (90) of the test unit and the top side of the integrated circuit.