IC Test Socket Noise Shielding via Segmented Ground Plating
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Solution Overview
Problem
Conventional socket devices face challenges in effectively shielding noise between probes due to increased speeds and decreased lead pitch in integrated circuits, leading to complex manufacturing processes and difficulties in preventing crosstalk.
Innovation Solution
A socket device with a conductive ground plating layer and a conductive shielding element that penetrates the upper and lower surfaces of the socket body to shield noise between adjacent signal probes, utilizing an insulating socket body with ground and signal holes, and a conductive shielding element to prevent crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a coaxial-type probe is adopted by plating the inner surface of a hole where the probe is accommodated in an insulator socket body, or a socket body is made of metal to shield noise between probes, then noise shielding between probes is improved, but manufacturing complexity increases and the manufacturing process becomes difficult
Solution Approach 1:
The patent divides the shielding function into separate components: ground probes are placed in ground holes with conductive ground plating layers, while signal probes are placed in signal holes. This segmentation allows independent optimization of ground and signal paths, achieving effective noise shielding without requiring complex metal socket bodies or coaxial structures.
Solution Approach 2:
The patent introduces an intermediary approach by using insulator socket bodies with separate ground holes and signal holes, where ground probes and signal probes are accommodated independently. This intermediary structure achieves noise shielding through proper grounding and spacing rather than through complex metal constructions, simplifying the manufacturing process.
2Productivity
If IC miniaturization, higher speed, and increased number of leads are implemented, then IC performance is improved, but crosstalk between probes increases and noise shielding becomes more difficult
Solution Approach 1:
The patent applies local quality by providing conductive ground plating layers specifically in the ground holes where ground probes are accommodated. This localized grounding approach effectively manages crosstalk and noise in high-speed IC applications without requiring universal complex shielding structures across the entire socket body.
Solution Approach 2:
By segmenting the socket body into distinct ground holes and signal holes with separate probe accommodations, the patent effectively isolates signal paths from ground paths. This segmentation prevents crosstalk even as IC lead density increases, maintaining signal integrity in high-speed applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an excellent noise shielding effect between signal probes while simplifying the manufacturing process, effectively addressing the challenges of crosstalk and complexity in conventional socket devices.
Implementation Method 1
a conductive shielding element provided to penetrate upper and lower surfaces of the socket body to shield noise between adjacent signal probes
Data Source
AI summary
Proposed is a socket device for testing integrated circuits (ICs). The socket device has an excellent noise shielding effect between signal probes and is easy to manufacture. The socket device with ground probes (10) and signal probes (20) includes an insulating socket body (110) having ground holes (110a) to accommodate the ground probes (10) and signal holes (110b) to accommodate the signal probes (20), a conductive ground plating layer (121) formed on the surface of each of the ground holes (110a), and a conductive shielding element (130) provided to penetrate the upper and lower surfaces of the socket body (110) to shield noise between adjacent signal probes (20).