IC Test Socket Holding Mechanism for Automatic Package Release

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Solution Overview

Problem

The existing sockets for IC packages require cumbersome operations to detach the IC package from the pressing surface, leading to decreased work efficiency during performance tests.

Innovation Solution

A socket design featuring a holding mechanism that engages with the IC package when pressed and releases engagement when the pressing member is separated by a predetermined distance, eliminating the need for manual peeling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the IC package is pressed toward the inspection board by a pressing member to ensure electrical connection, then electrical connection reliability is improved, but the IC package unintentionally attaches to the pressing surface requiring manual peeling operations

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidease of detaching IC package
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

A holding part is introduced as an intermediary component between the pressing member and the IC package. The holding part engages with the IC package during pressing operations and automatically releases it after testing, mediating the interaction between the pressing member and the IC package to prevent unwanted attachment while ensuring reliable electrical connection during the test process

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If manual peeling operations are required to detach the IC package from the pressing surface, then electrical connection reliability is ensured, but work efficiency decreases

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidwork efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The holding part is designed to automatically engage with the IC package during pressing and self-release when the pressing member is separated by a predetermined distance. This self-service mechanism eliminates the need for manual peeling operations, allowing the system to perform the detachment function automatically and thereby improving work efficiency without compromising electrical connection reliability

Inventive Principle:
Principle #25Self-service

3Productivity

If the holding part engages with the IC package during pressing, then manual peeling operations are eliminated, but the device structure becomes more complex

Engineering Contradiction:
Improvework efficiencyVSAvoidsocket structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The socket is segmented into distinct functional components: a socket body, a pressing member, and a holding part with engagement and release functions. This segmentation allows each component to perform its specific function independently, simplifying the overall design while achieving automated engagement and release without requiring complex integrated mechanisms

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12099077B2Socket
Publication Date: 2024.09.24 ENPLAS CORP
  • US12099077B2 patent drawing
  • US12099077B2 patent drawing
  • US12099077B2 patent drawing

AI summary

A socket for electrically connecting a first electrical component, the upper surface of which is pressed upon by a pressing member, and a second electrical component which is positioned below the first electrical component, said socket being equipped with: a socket main body which has a placement surface on which the first electrical component is placed; and a holding part which is provided to the socket main body, holds the first electrical component to the socket main body by engaging the first electrical component in a pressed state in which the first electrical component is pressed upon by the pressing member, and releases the engagement with the first electrical component when the pressing member moves a prescribed distance away from the position which corresponds to the pressed state.