IC Package Testing Device ESD Protection via Conductive Path

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Solution Overview

Problem

Existing testing devices for semiconductor IC packages, particularly 3D-ICs, face issues with electrostatic discharge (ESD) damage and noise interference during testing, which can lead to performance degradation or failure, especially in 5G mobile network applications.

Innovation Solution

A testing device with a newly created conductive path from the top cover through the testing socket to a ground layer of the printed circuit board is designed to provide ESD protection and noise shielding, using a conductive element assembly and conductive fasteners to ensure effective discharge and shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional testing devices are used for IC packages, then testing functionality is provided, but ESD damage and noise interference occur during testing

Engineering Contradiction:

Improvetesting reliabilityVSAvoidESD damage and noise interference

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A conductive element assembly is introduced as an intermediary component between the cover and the testing socket. This assembly includes conductive elements that extend from the inner surface of the cover into the testing socket, creating a mediated conductive path that shields the testing environment from ESD and noise while maintaining testing functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent converts the potentially harmful conductive elements that could cause short circuits into beneficial shielding elements. By strategically positioning these conductive elements along the conductive path from the cover through the testing socket to the PCB, they create ESD protection and noise shielding, turning what could be a harmful factor into a protective mechanism.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If conductive elements are added for ESD protection, then protection capability is improved, but device complexity increases

Engineering Contradiction:

ImproveESD protection capabilityVSAvoidtesting device structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The conductive element assembly is merged with the existing cover structure of the testing device. The conductive elements are integrated into the cover and extend through the testing socket, combining the protective shielding function with the existing mechanical structure rather than adding completely separate components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conductive element assembly serves multiple functions simultaneously: it provides ESD protection, shields against noise interference, and maintains the structural integrity of the testing device. This multi-functionality reduces the need for additional separate protective components, thereby limiting the increase in device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the protection of both the testing device and the IC package, improving the reliability of the testing procedure by preventing ESD damage and shielding noise interference.

Implementation Method 1

a conductive path from the top cover through the testing socket to a ground layer of the printed circuit board is provided for discharging static electricity built up on the IC package

Methodology Applied

Scientific EffectElectrostatic Discharge: Electrostatic Discharge

Implementation Method 2

The testing device includes a newly created conductive path from the top cover through the testing socket to a ground layer of the printed circuit board for shielding noise

Methodology Applied

Scientific EffectElectromagnetic Shielding: Faraday Cage

Data Source

PatentUS11994534B2Testing device for integrated circuit package

Publication Date: 2024.05.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A testing device for testing an integrated circuit package is provided, including a printed circuit board, a testing socket, a conductive fastener, a cover, and a conductive element assembly. The printed circuit board includes a first metal layer formed on the bottom surface thereof. The testing socket is disposed above the printed circuit board. The conductive fastener is configured to secure the testing socket to the printed circuit board, wherein the conductive fastener is electrically connected to the first metal layer and the testing socket. The cover is disposed above the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket, wherein the cover makes electrical contact with the integrated circuit package. The conductive element assembly is disposed between and electrically connected to the cover and the testing socket.