IC Testing Interface Slugs for High Voltage Isolation Accuracy

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Solution Overview

Problem

High voltage testing of isolation ICs often results in test inaccuracies due to non-negligible charge detection, which can be attributed to design and test vulnerabilities such as partial discharge or arcing caused by the test board's geometry and conductor proximity, leading to false isolation failure detection.

Innovation Solution

The IC testing assembly employs a configuration with slugs and electrodes designed to minimize electric field vulnerabilities, using dielectric materials and smooth surface transitions to reduce the likelihood of arcing, and a plunger head system that ensures uniform electrical field distribution, thereby preventing false failure detection during high voltage testing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional FR-4 test board with standard test electrodes is used, then testing capability is provided, but test accuracy deteriorates due to partial discharge and arcing causing false failure detection

Engineering Contradiction:
Improvetest accuracyVSAvoidpartial discharge and arcing
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces slugs as intermediary components between the test electrodes and the IC pins. These slugs are made of conductive material and provide a controlled interface that eliminates uncontrolled electric field paths. The slugs act as mediators that transfer the high voltage test signal while preventing partial discharge and arcing that would otherwise occur in the air gaps between traditional test electrodes and IC pins.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the physical parameters of the testing interface by using slugs with specific dimensions, materials, and positioning. The slugs are designed with controlled geometry (size, shape, position) that optimizes the electric field distribution. This parameter change transforms the testing interface from a traditional open-air electrode configuration to a controlled slug-based interface that prevents harmful electrical discharges.

Inventive Principle:
Principle #35Parameter changes

2Ease of operation

If test electrodes are positioned close to IC pins for alignment, then testing convenience is improved, but electric field vulnerabilities increase causing charge leakage

Engineering Contradiction:
Improvealignment convenienceVSAvoidcharge leakage
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The slugs serve as intermediary components that physically bridge the gap between the test board and IC pins. They provide a controlled conductive path that eliminates uncontrolled charge leakage paths. The slugs are positioned to ensure proper alignment while maintaining controlled electric field boundaries, thus preventing charge leakage even when positioned close to the IC pins.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs smooth surface transitions and curved geometries in the slug design to eliminate sharp edges and corners. This curvature prevents electric field concentration at sharp points, which would otherwise initiate partial discharge and arcing. The smooth surfaces ensure uniform electric field distribution and prevent charge leakage while maintaining alignment convenience.

Inventive Principle:
Principle #14Spheroidality (Curvature)

3Reliability

If high voltage is applied between test electrodes, then isolation testing is performed, but false failure detection occurs due to air discharge and test board design vulnerabilities

Engineering Contradiction:
Improveisolation testing reliabilityVSAvoidfailure detection accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The slugs act as intermediary conductive elements that provide a controlled path for high voltage application. They eliminate uncontrolled air discharge paths between the test electrodes and IC pins. By mediating the high voltage transfer, the slugs ensure that any detected charge flow truly indicates IC isolation failure rather than test system vulnerabilities, thus improving both reliability and measurement precision.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The smooth, curved surfaces of the slugs prevent electric field concentration that would cause partial discharge and arcing. This geometric design ensures that high voltage is applied uniformly without creating localized breakdown paths through air or along the test board. The curvature eliminates sharp edges where electric field intensity would be highest, preventing false failure detection while maintaining testing reliability.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the occurrence of test errors caused by partial discharge or arcing, allowing for accurate high voltage testing without false isolation failures, ensuring reliable evaluation of the IC's internal barrier integrity.

Implementation Method 1

a plunger head system that ensures uniform electrical field distribution, thereby preventing false failure detection during high voltage testing

Methodology Applied
Scientific EffectElectric field: Electric Field

Implementation Method 2

using dielectric materials and smooth surface transitions to reduce the likelihood of arcing

Methodology Applied
Scientific EffectDielectric: Dielectric

Data Source

PatentUS20210231729A1High voltage integrated circuit testing interface assembly
Publication Date: 2021.07.29 TEXAS INSTRUMENTS INC
  • US20210231729A1 patent drawing
  • US20210231729A1 patent drawing
  • US20210231729A1 patent drawing

AI summary

An integrated circuit testing assembly that includes: (i) a first slug configured to contact a first surface of a first set of pins of an integrated circuit; (ii) a second slug configured to contact a second surface of the first set of pins of the integrated circuit; (iii) a third slug configured to contact a first surface of a second set of pins of the integrated circuit; and (iv) a fourth slug configured to contact a second surface of the second set of pins of the integrated circuit.