Adaptive IC Thermal Control With Accumulator Ramp-Up

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Solution Overview

Problem

High-performance CPUs and SoCs face challenges in managing critical thermal transients due to the limitations of classical proportional-integral (PI) control systems, which require significant silicon area and are not responsive enough to rapid thermal changes, often resulting in sub-optimal performance.

Innovation Solution

An adaptive thermal control system that uses a control unit to compare temperature readings to multiple set points, increment or decrement an accumulator with a programmable gain value, and prime it with a preset ramp-up value to quickly respond to thermal gradients, optimizing temperature modulation through an actuator that adjusts system parameters.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a classical proportional-integral (PI) control system is implemented, then thermal control accuracy is improved, but silicon area and implementation complexity increase significantly

Engineering Contradiction:
Improvethermal control accuracyVSAvoidsilicon area
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent extracts only the essential integral control function needed for thermal management, removing the complex proportional and derivative components of a classical PI controller. This selective extraction maintains adequate thermal control accuracy while dramatically reducing the silicon area and implementation complexity required.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs a simplified accumulator-based control mechanism that uses basic digital logic components instead of complex analog circuitry. This approach uses simpler, more area-efficient components that can be implemented with standard digital logic, reducing overall silicon real estate requirements while maintaining functional effectiveness.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Area of stationary object

If a simplified control scheme is applied, then silicon area is reduced, but response speed to thermal transients becomes insufficient

Engineering Contradiction:
Improvesilicon areaVSAvoidresponse speed
Core Design Contradiction:
Area of stationary objectVSSpeed

Solution Approach 1:

The patent implements a look-ahead mechanism that anticipates thermal transients by monitoring temperature trends and proactively adjusting performance before critical thermal conditions occur. This preliminary action allows the simplified controller to respond faster to thermal changes without requiring complex real-time calculation hardware.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces dynamic adjustment of control parameters based on operating conditions. The controller adapts its response characteristics in real-time, increasing aggressiveness during rapid thermal transients and reducing activity during stable conditions, thereby achieving fast response speed with minimal silicon area.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If software control loops are used, then implementation flexibility is maintained, but response time to critical thermal transients increases

Engineering Contradiction:
Improveimplementation flexibilityVSAvoidresponse time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent replaces software-based thermal control with a hardware-implemented state machine that operates autonomously based on temperature sensor inputs. This hardware substitution eliminates software execution delays and interrupt handling overhead, achieving deterministic sub-cycle response times while maintaining configurability through hardware parameters.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS11347198B2Adaptive thermal control system
Publication Date: 2022.05.31 APPLE INC
  • US11347198B2 patent drawing
  • US11347198B2 patent drawing
  • US11347198B2 patent drawing

AI summary

Systems, apparatuses, and methods for implementing an optimized adaptive thermal control mechanism for an integrated circuit (IC) are described. A control unit receives a digital input value which is representative of a temperature of an IC. The control unit compares the input value to at least two set points. A result of a first comparison determines whether an accumulator is incremented or decremented by a programmable gain value. A result of a second comparison determines whether the accumulator is primed with a preset ramp-up value. The preset ramp-up value is used since the accumulator can take several sensing cycles to reach the optimal control value while thermal gradients can become critical in only a few cycles. The output of the accumulator is provided to an actuator which adjusts parameter(s) to modulate the IC's temperature. The granularity and range of the accumulator matches the granularity and range of the actuator.