IC Thermal Assembly With Compression Plates for Socket Contact
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Solution Overview
Problem
Integrated circuits in electronic devices face challenges in maintaining electrical and mechanical contact under increased bending moments and thermal energy dissipation needs, particularly as they generate more heat and require additional contacts, which can lead to separation and performance issues.
Innovation Solution
The solution involves using a combination of thermal components such as vapor chambers and fin stacks, along with high-modulus plates and biasing components, to provide a compression force that maintains contact between the integrated circuit and the circuit board, while also facilitating thermal energy extraction and minimizing airflow blockage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If integrated circuits operate at higher frequencies to enhance performance, then processing speed is improved, but thermal energy generation increases
Solution Approach 1:
The patent converts the harmful thermal energy generated by high-frequency operation into a manageable parameter by implementing thermal extraction pathways. The housing and internal structures are designed to conduct and dissipate heat away from the integrated circuit, transforming the harmful thermal byproduct into a controlled thermal management system that enables sustained high-performance operation.
2Productivity
If the integrated circuit size is increased to accommodate more operations, then operational capacity is improved, but maintaining electrical contact becomes more difficult
Solution Approach 1:
The patent segments the electrical contact interface into multiple discrete contact points distributed across the integrated circuit package. This segmentation allows each individual contact to maintain reliable connection despite the overall increased size of the circuit, as the bending moment is distributed across multiple connection points rather than concentrated at a single interface.
3Productivity
If additional contacts are added to the integrated circuit to increase operations, then operational capacity is improved, but maintaining electrical connections becomes more challenging
Solution Approach 1:
The housing structure serves multiple functions simultaneously: it provides mechanical support for the integrated circuit, maintains compression force on the contact interface, and acts as a thermal extraction pathway. This multi-functionality reduces the need for additional specialized components that would otherwise be required to manage the increased number of electrical connections.
4Reliability
If compression force is applied to maintain contact between integrated circuit and circuit board, then electrical connection reliability is improved, but thermal dissipation may be compromised
Solution Approach 1:
The patent applies different local qualities to different regions of the housing and mounting structure. Areas in contact with the integrated circuit package provide compression force to maintain electrical connection, while adjacent regions incorporate thermal extraction features such as heat sinks or thermal conduits. This spatial differentiation allows simultaneous optimization of both contact reliability and thermal dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively maintains contact and prevents separation between the integrated circuit and the circuit board, ensuring reliable operation and thermal management, even with larger, more advanced integrated circuits, by providing consistent compression forces and efficient thermal dissipation.
Implementation Method 1
a biasing component, such as a spring, that provides a compression force
Implementation Method 2
integrated circuits operating at higher operating frequencies may generate additional thermal energy. In order to limit performance of and/or prevent damage to the integrated circuit, thermal energy should be substantially extracted and drawn away
Data Source
AI summary
This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.