Integrated Circuit Thermal Analysis via Conductivity Groups
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Solution Overview
Problem
Current thermal analysis methods for integrated circuit (IC) design are inefficient due to slow convergence and complexity, particularly in accounting for wiring, which affects heat flow and power dissipation.
Innovation Solution
A method that divides the IC design layout into elements with conductivity groups, computing effective thermal conductivity values and solving heat flow equations to identify temperature distribution, considering both dielectric and wiring components, to efficiently perform thermal analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If iterative interactions between power and thermal analysis tools are used, then thermal analysis accuracy is improved, but computational time and complexity increase
Solution Approach 1:
The patent merges power analysis and thermal analysis into a single unified analysis process. The power analysis tool directly computes thermal maps by incorporating thermal models into the power analysis workflow, eliminating the need for separate iterative interactions between power and thermal analysis tools. This integration achieves both accuracy and efficiency by solving the thermal problem within the existing power analysis framework.
Solution Approach 2:
The patent performs preliminary thermal model setup and conductivity group computation during the power analysis phase. By pre-computing thermal conductivity values for different wiring configurations and preparing thermal models in advance, the system avoids time-consuming iterative thermal analyses later. The thermal analysis is embedded into the power analysis workflow, allowing thermal results to be obtained as part of the standard power analysis process.
2Measurement precision
If wiring details are included in thermal analysis, then thermal analysis accuracy is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by computing thermal conductivity values specifically for different wiring configurations within the IC layout. Instead of using a single uniform thermal model, the system calculates distinct thermal conductivity groups based on local wiring patterns (e.g., dense wiring vs. sparse wiring regions). This allows accurate thermal analysis that accounts for local variations in wiring density and configuration without requiring a completely complex global model.
Solution Approach 2:
The patent changes the thermal conductivity parameter based on wiring characteristics. By computing different thermal conductivity values for different wiring configurations and incorporating these parameter variations into the thermal model, the system achieves accurate thermal analysis that reflects actual wiring conditions. This parameter-based approach simplifies the overall complexity by using adjustable conductivity values rather than complex geometric modeling of every wiring detail.
3Measurement precision
If iterative power and thermal analysis is performed, then convergence accuracy is improved, but productivity decreases
Solution Approach 1:
The patent combines power analysis and thermal analysis into a single simultaneous computation rather than performing separate iterative analyses. The power analysis tool integrates thermal modeling capabilities, allowing both power dissipation and temperature distribution to be computed together in one analysis pass. This merging eliminates the need for multiple iterative exchanges between separate tools, significantly improving productivity while maintaining convergence accuracy through unified calculation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces computational time and complexity by directly computing thermal maps and power reports without iterative interactions between power and thermal analysis tools, effectively accounting for wiring's impact on thermal analysis.
Implementation Method 1
computes a set of conductivity groups of values for the set of elements... computing effective thermal conductivity values... solving heat flow equations to identify temperature distribution
Data Source
AI summary
Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) design layout that includes numerous circuit modules. The method divides the IC design layout into a set of elements, where at least one element includes several wires. The method computes a set of conductivity groups of values for the set of elements. The method identifies a temperature distribution for the IC design layout based on the set of conductivity groups of values. In some embodiments, each of these elements corresponds to a particular portion of a particular layer of the IC design layout. Each element includes several nodes. Each conductivity group of values is defined by entry values. Each entry value describes how heat flow at a particular node of the element is affected by a temperature change at another particular node of the element.