IC Thermal Sensor Layout With Guard Ring Heat Conduction
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Solution Overview
Problem
As integrated circuits (ICs) generate heat, leading to non-uniform temperature distribution and reduced accuracy in temperature measurement due to decreased heat transfer interfaces, existing temperature sensors struggle to accurately monitor IC temperatures, impacting performance and power consumption.
Innovation Solution
A temperature sensor arrangement with thermally conductive features connected to transistors in a guard ring region, providing multiple thermally conductive paths to improve temperature measurement accuracy by transferring thermal energy directly from the guard ring to the sensor array, allowing for more precise temperature control and reduced power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If device node size decreases to increase integration density, then productivity increases, but heat transfer irregularity increases causing non-uniform temperature distribution
Solution Approach 1:
The patent introduces a guard ring region as an intermediary thermal management structure between the high-density device region and the temperature sensor. This guard ring acts as a thermal mediator that collects and redistributes heat, providing a more representative temperature measurement to the sensor while accounting for the non-uniform heat distribution caused by decreased device node sizes.
Solution Approach 2:
The guard ring region utilizes the heat generated by the surrounding high-density devices to serve the temperature sensing function. Instead of requiring separate heating mechanisms, the system uses the self-generated thermal energy from device operation to maintain the guard ring at a temperature representative of the IC core, enabling accurate temperature monitoring without external intervention.
2Productivity
If non-planar device structures like FinFETs are used to increase density, then productivity increases, but heat transfer area to substrate decreases worsening temperature measurement accuracy
Solution Approach 1:
The guard ring serves as a thermal intermediary that decouples the temperature sensing measurement from the direct device-substrate heat transfer path. Since FinFETs have reduced substrate contact area, the guard ring provides an alternative thermal pathway that captures the operational temperature of the high-density region without being limited by the reduced substrate interface, thereby maintaining measurement precision despite increased device density.
3Use of energy by moving object
If thermal sensors are used to measure IC temperature for cooling control, then power consumption of cooling devices is reduced, but temperature measurement accuracy deteriorates due to heat transfer irregularities
Solution Approach 1:
The guard ring acts as a thermal intermediary between the high-density device region and the temperature sensor, providing a more accurate representation of the IC core temperature. By positioning the sensor to measure the guard ring temperature rather than directly measuring device temperature, the system achieves better measurement precision that enables more efficient cooling control and reduces overall power consumption.
Solution Approach 2:
The patent creates a localized thermal environment in the guard ring region that has different thermal characteristics than the surrounding high-density device region. This local quality modification allows the temperature sensor to measure a temperature that is representative of the IC core operating conditions, improving measurement accuracy without increasing power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances temperature measurement accuracy, enabling more precise control of temperature management within ICs, reducing power consumption by ensuring accurate activation and deactivation of cooling mechanisms, and maintaining proper IC performance despite increased device density and reduced heat transfer interfaces.
Implementation Method 1
a thermally conductive element between the sensor array and the guard ring region, wherein the thermally conductive element is connected to the transistor structure, the first transistor and each of the plurality of second transistors
Data Source
AI summary
A system for designing a temperature sensor arrangement includes a processor and a non-transitory computer readable medium, including instructions, connected to the processor. The processor is configured to execute the instructions for designing a sensor array, the sensor array includes a first transistor of a first device, and a plurality of second transistors of a second device. The processor is configured to execute the instructions for designing a guard ring region between the sensor array and another circuit of an integrated circuit, the guard ring region includes a transistor structure. The processor is configured to execute the instructions for designing a thermally conductive element between the sensor array and the guard ring region, the thermally conductive element is connected to the transistor structure, the first transistor and each of the plurality of second transistors. The processor is configured to execute the instructions for generating the temperature sensor arrangement.