Integrated Circuit Timing Signoff via Path Derating
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Solution Overview
Problem
Existing IC design methodologies fail to accurately account for local voltage drops due to on-chip variations during the manufacturing process, leading to missed timing risks in integrated circuit designs.
Innovation Solution
A system and method that determine first and second timings of a signal transition sequence based on IC design signoff voltage and voltage drops, calculating a path derating factor from the timing gap, and using this factor to evaluate the design, allowing for expanded timing risk detection and user-specified signoff level definition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional IC design methodologies are used, then the design process is simpler and faster, but timing risks due to voltage drops are missed
Solution Approach 1:
The patent applies preliminary action by calculating path derating factors before final timing signoff. The methodology performs preliminary timing analysis that accounts for voltage drops and on-chip variations, establishing derating factors that are then applied in the final signoff analysis. This ensures timing risks are identified and addressed before the design is finalized, preventing timing failures without requiring complete redesign.
Solution Approach 2:
The patent applies parameter changes by introducing voltage drop considerations and on-chip variation parameters into the timing analysis. Instead of using only nominal voltage values, the methodology modifies the analysis parameters to include actual voltage drops along signal paths and statistical variations in transistor characteristics. This transforms the timing analysis from a simple nominal-value check to a comprehensive parameter-based assessment that captures real-world behavior.
2Measurement precision
If voltage drops and on-chip variations are incorporated into timing analysis, then timing risk detection is improved, but computational complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the IC design into multiple signal paths and calculating timing characteristics for each path separately. The methodology segments the complex design into manageable path-level analyses, where voltage drops and on-chip variations are evaluated for individual paths rather than the entire design at once. This segmentation enables precise timing analysis while keeping computational complexity tractable through systematic decomposition.
Solution Approach 2:
The patent applies parameter changes by transforming the timing analysis from using fixed nominal values to using statistically-derived parameters that account for on-chip variations. The methodology calculates mean and standard deviation parameters for timing characteristics based on transistor variation data, then uses these statistical parameters to determine timing signoff values. This parameter transformation improves measurement precision by capturing real-world variability while maintaining analytical tractability through statistical methods.
3Reliability
If path derating factors are calculated based on timing gaps, then design evaluation becomes more accurate, but additional calculation steps are required
Solution Approach 1:
The patent applies preliminary action by calculating path derating factors during the timing analysis phase, before final design signoff. The methodology performs preliminary calculations of voltage drops and timing gaps, establishes derating factors, and then applies these factors in the final evaluation. This preliminary establishment of derating factors avoids the need for iterative recalculations during signoff, reducing overall design cycle time while maintaining high evaluation accuracy.
Solution Approach 2:
The patent applies parameter changes by transforming raw timing gap measurements into normalized derating factor parameters. The methodology calculates timing gaps between arrival and required times, then converts these gaps into derating factors that can be directly applied to timing signoff analysis. This parameter transformation condenses complex timing gap information into actionable derating parameters, improving design evaluation accuracy while streamlining the calculation process for practical implementation.
Data Source
AI summary
A method includes determining a first timing of a transition sequence of a signal on a first path of an integrated circuit (IC) design, the first timing being based on an IC design signoff voltage, determining a second timing of the transition sequence of the signal on the first path, the second timing being based on the signoff voltage and a first voltage drop along the first path, calculating a first path derating factor based on a timing gap between the first and second timings of the transition sequence, and using the first path derating factor to evaluate the IC design.


