Integrated Circuit Tooling Signature Authentication

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Solution Overview

Problem

Existing methods fail to reliably authenticate integrated circuits (ICs) to ensure they are from trusted sources, particularly in scenarios where manufacturing facilities do not adhere to security procedures, making it difficult to distinguish between genuine and counterfeit ICs.

Innovation Solution

The approach involves measuring and analyzing the unique, uncontrollable nano- or atomic-scale variations in ICs produced by specific tooling, such as reticles, to create a 'fingerprint' or 'signature' that is nearly impossible to clone, allowing for the identification of authorized tooling used in manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If watermarks are intentionally introduced into tooling to identify ICs, then IC authentication capability is improved, but the method can be cloned by adversaries

Engineering Contradiction:
ImproveIC authentication capabilityVSAvoidcloning vulnerability
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful effect of uncontrollable tooling variations (which create noise and reduce manufacturing precision) into a beneficial authentication feature. By measuring and analyzing these variations through statistical methods, the system creates unique tooling fingerprints that cannot be cloned, thereby improving IC authentication capability while eliminating the cloning vulnerability of intentional watermarks.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If PUF technology is used to identify unique device characteristics, then device individuality is improved, but tooling-related correlation reduces entropy and affects PUF performance

Engineering Contradiction:
Improvedevice individualityVSAvoidentropy reduction
Core Design Contradiction:
ReliabilityVSLoss of information

Solution Approach 1:

The patent extracts tooling-related correlations from the measured data and separates them from device-specific variations. By using statistical analysis to identify and isolate the tooling fingerprint component, the system preserves the entropy required for PUF performance while still achieving device individuality through tooling identification. This extraction process eliminates the harmful effect of entropy reduction.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of manufacture

If ICs are produced in facilities without stringent security protocols, then manufacturing cost and accessibility are improved, but the ability to ensure trusted source becomes compromised

Engineering Contradiction:
Improvemanufacturing accessibilityVSAvoidtrusted source verification
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent enables self-service authentication where the IC carries its own tooling fingerprint embedded in its physical characteristics. The authentication system uses statistical analysis of measured parameters to verify the IC's origin without requiring external security infrastructure or protocols. This self-contained approach allows ICs to be authenticated as from trusted sources even when manufactured in facilities without stringent security protocols.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS10114369B2Identifying integrated circuit origin using tooling signature
Publication Date: 2018.10.30 MICROSEMI SOC CORP
  • US10114369B2 patent drawing
  • US10114369B2 patent drawing
  • US10114369B2 patent drawing

AI summary

A method for determining if an individual integrated circuit was manufactured using an individual instance of tooling includes collecting from the individual integrated circuit first data representing at least one attribute that varies as a function of the tooling used to manufacture the individual integrated circuit and second data identifying the integrated circuit as having been manufactured using the individual instance of tooling. The first data is compared to a signature of the individual instance of tooling identified by the second data. The signature is derived from the at least one attribute measured from a population of integrated circuits that were manufactured using the individual instance of tooling. The individual integrated circuit is identified as having been manufactured using the individual instance of tooling identified in the second data collected from the individual integrated circuit if the first data correlates to the signature by a predetermined threshold.