Integrated Circuit Transformer With Via Fin Coupling
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Solution Overview
Problem
Conventional integrated circuit transformers with high coupling factors require increased turn counts, leading to larger layout areas and higher fabrication costs, necessitating a novel design that enhances coupling efficiency without increasing layout size.
Innovation Solution
The design incorporates a first and second coiled metal pattern with an inner and outer loop segment, a dielectric layer, and a T-shaped conductive feature formed by a via fin and redistribution pattern, which electrically connects and extends along the coiled metal patterns, improving coupling factor k by enabling both lateral and vertical coupling effects without additional processes or design rules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the turn counts of primary and secondary windings are increased to improve coupling factor, then the coupling factor k is improved, but the layout area increases and fabrication cost increases
Solution Approach 1:
The patent introduces a via structure that extends the secondary winding into the vertical dimension, allowing the winding to pass through the dielectric layer and connect to additional turns below. This three-dimensional configuration increases the effective coupling area between primary and secondary windings without proportionally increasing the planar layout area, thereby improving coupling factor while controlling area usage.
Solution Approach 2:
The via structure nests additional winding turns within the vertical space occupied by the existing planar structure. The secondary winding is configured to extend through the dielectric layer via the via, effectively nesting additional turns within the footprint of the original layout, thus increasing coupling without proportional area increase.
2Reliability
If the turn counts of primary and secondary windings are increased to improve coupling factor, then the coupling factor k is improved, but the fabrication cost increases
Solution Approach 1:
The via structure serves multiple functions simultaneously: it acts as an electrical connection element, provides additional winding turns to improve coupling, and enables three-dimensional integration within the planar process flow. This multi-functionality allows the same structural element to achieve multiple objectives, reducing the need for additional specialized components or processes that would increase fabrication cost.
3Reliability
If a via structure is introduced to enable vertical coupling, then coupling factor k is improved, but device complexity increases
Solution Approach 1:
The via structure is merged with the existing winding pattern and dielectric layer formation processes. The via is formed as part of the standard interconnect process flow, and the secondary winding is continuously patterned to include both planar and vertical segments. This merging of functions into existing process steps minimizes the addition of discrete complexity while achieving the desired coupling enhancement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the coupling factor k by creating a larger effective coupling area between primary and secondary windings, reducing energy loss and fabrication costs while maintaining a compact layout.
Implementation Method 1
A first T-shaped conductive feature is disposed on the first coiled metal pattern and the second coiled metal pattern, electrically connecting to one of the first and second coiled metal patterns
Implementation Method 2
The coupling factor of a transformer is dependent on the portion of the total flux lines that cuts both primary and secondary windings of the transformer
Data Source
AI summary
The invention provides an integrated circuit transformer disposed on a substrate. The integrated circuit transformer includes a first coiled metal pattern disposed on the substrate, comprising an inner loop segment and an outer loop segment. A second coiled metal pattern is disposed on the substrate, laterally between the inner loop segment and the outer loop segment. A dielectric layer is disposed on the first coiled metal pattern and the second coiled metal pattern. A first via is formed through the dielectric layer, electrically connecting to one of the first and second coiled metal patterns. A first redistribution pattern is disposed on the dielectric layer, electrically connecting to and extending along the first via, wherein the first redistribution pattern covers at least a portion of the first coiled metal pattern and at least a portion of the second coiled metal pattern.