Configurable IC Package Transformer for Power Efficiency
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Solution Overview
Problem
Conventional mobile wireless devices are power inefficient due to transmit and receive circuitry, significantly impacting battery life, as they consume a large portion of the device's power and are not optimized for power efficiency.
Innovation Solution
A transformer is embedded in a multi-layer IC package with a configurable windings ratio, controlled by logic, circuitry, and code within the IC, using ferromagnetic material for improved magnetic coupling, allowing for adjustable impedance to maintain signal voltage and current levels within safe limits, thereby reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If transmit and receive circuitry operates at high power levels, then signal transmission capability is improved, but power consumption increases significantly
Solution Approach 1:
The transformer winding ratio is made dynamically configurable through switching circuitry that can select between different primary and secondary winding combinations. This allows the transformer to adapt its impedance transformation ratio based on operating conditions, enabling efficient power transfer at both high and low power levels without sacrificing signal transmission capability or excessive power consumption.
Solution Approach 2:
The patent changes the electrical parameter of impedance transformation ratio by providing multiple selectable winding ratios (e.g., 1:1, 1:2, 1:4, 4:1, 2:1). This parameter variation allows the circuit to optimize power transfer efficiency across different operating conditions, resolving the contradiction between maintaining signal transmission capability and reducing power consumption.
2Adaptability or versatility
If transformer winding ratio is fixed, then device complexity is reduced, but adaptability to different signal levels is limited
Solution Approach 1:
The transformer incorporates switching circuitry that dynamically reconfigures the winding connections based on detected signal levels. The system can switch between different primary windings (N1, N2, N3) and secondary windings (n1, n2, n3) to provide appropriate impedance matching for various signal conditions, achieving high adaptability without substantial complexity increase.
Solution Approach 2:
The transformer is designed with multiple windings that can serve different functions depending on configuration. The same physical transformer structure provides multiple impedance ratios, allowing a single component to fulfill multiple impedance matching requirements across different operating modes, thereby achieving versatility without proportionally increasing device complexity.
3Power
If voltage swing is large, then signal strength is improved, but risk of damage to circuitry increases
Solution Approach 1:
The transformer provides multiple selectable impedance transformation ratios that can be chosen based on signal strength requirements. When high signal strength is needed, appropriate winding ratios can be selected to achieve the desired voltage transformation while maintaining circuit safety through proper impedance matching, thus resolving the contradiction between signal strength and circuitry protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances power efficiency by dynamically adjusting the transformer's windings ratio based on signal levels, preventing damage from large voltage swings and optimizing battery life in mobile wireless devices.
Implementation Method 1
The IC and/or the multi-layer package may comprise ferromagnetic material which may, for example, improve magnetic coupling of the transformer.
Data Source
AI summary
Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a multi-layer IC package bonded to an IC may be configured, via logic, circuitry, and/or code in the IC, based on signal levels at one or more terminals of the transformer. The transformer may comprise a plurality of inductive loops fabricated in transmission line media. The integrated circuit may be flip-chip bonded to the multi-layer package. The IC may comprise a signal strength indicator enabled to measure signal levels input to or output by the transformer. The windings ratio may be configured via one or more switches in the IC and/or in the multi-layer package. The IC and/or the multi-layer package may comprise ferromagnetic material which may improve magnetic coupling of the transformer.