IC Tray with Through-Holes for Multi-Spec Testing
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Solution Overview
Problem
The increasing variety of Integrated Circuit (IC) package specifications leads to a proliferation of connection components in handlers, complicating the transfer and testing process, as each type requires specific components, resulting in inefficiencies and increased complexity.
Innovation Solution
An IC tray with through-holes arranged to match the terminal pitch of IC packages, allowing for simultaneous mounting and testing of multiple IC packages of different specifications, using a tray transfer mechanism that aligns and presses the packages onto a test board with corresponding test pins, reducing the need for multiple connection components and simplifying the testing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple types of connection components are used to handle different IC package specifications, then the handler can accommodate various IC package types, but the device complexity and number of components increase
Solution Approach 1:
The IC tray is designed with a universal structure that can accommodate multiple types of IC packages simultaneously. The tray includes multiple mounting positions with through-holes arranged at different pitches, allowing a single tray to handle various IC package specifications without requiring multiple specialized connection components.
Solution Approach 2:
The IC tray is divided into multiple independent mounting positions, each capable of holding a different type of IC package. This segmentation allows each position to be optimized for specific package types while the overall tray structure remains a single reusable component, reducing the need for multiple complete connection components.
2Reliability
If IC packages are transferred one by one to IC sockets by handler, then individual testing can be performed, but the test time increases
Solution Approach 1:
Multiple IC packages are mounted simultaneously on a single IC tray and transferred together to the test board. This merging of multiple individual transfer operations into a single batch operation significantly reduces the total test time while maintaining the ability to perform individual testing through the through-holes that align with test pins.
Solution Approach 2:
The IC tray allows continuous testing of multiple IC packages in sequence without requiring the handler to reposition or re-grasp each package individually. Once the tray is transferred to the test board, all IC packages can be tested continuously, eliminating the repetitive motion and time loss associated with sequential individual transfers.
3Ease of operation
If multiple connection components are used for different IC package specifications, then each IC package type can be handled appropriately, but the operational complexity increases
Solution Approach 1:
The IC tray serves as a universal handling component that replaces multiple specialized connection components. A single tray design with configurable mounting positions can accommodate various IC package types, simplifying the operational procedure to using just one component type while maintaining the ability to handle different specifications.
Data Source
AI summary
According to one embodiment, an IC tray mounting thereon IC packages to be tested includes a plurality of through-holes provided at a pitch equal to a pitch of terminals of the IC packages, and IC package mounting places on which the IC packages are to be mounted. The through-holes are provided in the IC package mounting places correspondingly to arrangement positions of the terminals of the IC packages. The IC package mounting places are provided correspondingly to a region of a test board where a plurality of test pins used for an electrical test to one of the IC packages are arranged.