IC Wire Arrangement via Signal Jump Interval Analysis
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Solution Overview
Problem
Integrated circuit manufacturing leads to increased chip density, resulting in significant coupling noise between wires, which causes signal time sequence damage, and existing solutions like spacing wires apart are limited by fixed channel arrangements in target regions.
Innovation Solution
A method and apparatus that calculate signal jump intervals and corresponding time influence factors to arrange wires in a target region, prioritizing spacing based on these factors to minimize noise performance impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If wires are arranged on channels spaced as far apart as possible to reduce coupling noise, then noise performance is improved, but device complexity increases due to insertion of short wires or blank channels
Solution Approach 1:
The patent changes the arrangement parameters of wires by calculating time influence factors based on signal jump intervals, and uses these factors to determine optimal wire positions that minimize coupling noise without requiring additional short wires or blank channels
Solution Approach 2:
The patent replaces the mechanical approach of physically inserting short wires or blank channels to increase spacing with a computational approach that calculates time influence factors and arranges wires optimally based on signal timing characteristics
2Object-affected harmful factors
If short wires or blank channels are inserted between long wires to reduce coupling noise, then coupling noise is reduced, but the solution becomes inapplicable when the number of wires approximates the number of available channels
Solution Approach 1:
The patent uses time influence factors derived from signal jump intervals to dynamically adjust wire arrangement parameters, making the solution adaptable to various wire densities and channel configurations without requiring fixed structural modifications
Solution Approach 2:
The patent implements a dynamic wire arrangement method that calculates time influence factors for each wire pair and adjusts positions accordingly, rather than using static pre-defined spacing rules, enabling adaptability to different wire counts and channel configurations
3Object-affected harmful factors
If channel spacing is increased to reduce coupling noise, then noise performance improves, but the utilization of target region becomes inefficient due to fixed channel constraints
Solution Approach 1:
The patent changes from fixed channel spacing to dynamic position arrangement based on time influence factors, allowing wires to be positioned optimally within the available target region area without being constrained to uniform channel intervals
Data Source
AI summary
A method, system, and computer program product for enhancing integrated circuit noise performance. The method is for arranging target wires in a target region, the method including: for each wire in the target wires, obtaining a signal jump interval with respect to each of the other wires in the target wires, wherein the signal jump interval of one wire with respect to a further wire is a time interval between occurrence of signal jump on the one wire and occurrence of signal jump on the further wire; calculating a corresponding time influence factor based on the signal jump interval, wherein the time influence factor is a decreasing function of the signal jump interval; and arranging the target wires in the target region based on the time influence factor. Coupling noise between wires may be reduced according to the technical solution of an embodiment of the present invention.