IC Layout Wiring and Illumination Configuration Alignment
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Solution Overview
Problem
Current integrated circuit (IC) design and manufacturing processes are not adequately aware of manufacturing constraints, leading to inefficiencies in wiring configurations and illumination settings, which can result in suboptimal IC layouts and increased production costs.
Innovation Solution
A process that concurrently selects optimal wiring and illumination configurations for IC design and manufacturing, allowing for the definition of different widths and spacings of routes on each layer, using various stepper lenses and illumination configurations to ensure accurate wire production in specific directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional preferred direction wiring models are used with alternating horizontal and vertical wiring layers, then routing simplicity is maintained, but wiring distance increases and manufacturing precision deteriorates
Solution Approach 1:
The patent introduces diagonal wiring directions (45 degrees and 135 degrees) as additional routing dimensions beyond the traditional horizontal and vertical directions. This allows wires to connect components more directly by utilizing diagonal paths, reducing overall wiring distance while improving manufacturing precision through specialized illumination configurations optimized for diagonal features.
Solution Approach 2:
The patent applies different illumination configurations specifically optimized for different wiring directions. Diagonal wiring layers use diagonal illumination configurations while horizontal/vertical layers use corresponding orthogonal configurations, allowing each wiring type to be manufactured with optimal precision for its specific orientation.
2Manufacturing precision
If design engineers use standard routing configurations without considering manufacturing constraints, then design flexibility is maintained, but manufacturing precision and yield deteriorate
Solution Approach 1:
The patent performs preliminary selection of illumination configurations during the design phase, matching specific illumination settings to specific wiring directions before manufacturing begins. This advance planning ensures that design rules are optimized for manufacturing capabilities from the outset, improving layout accuracy without significantly increasing design complexity.
Solution Approach 2:
The patent changes key parameters including wiring directions (introducing 45 and 135 degree angles), route widths, and spacing based on manufacturing capabilities. By adjusting these parameters to align with manufacturing constraints, the system achieves higher manufacturing precision while managing design complexity through systematic parameter optimization.
3Manufacturing precision
If different route widths and spacings are defined for different directions on each layer, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The patent defines different route widths and spacings specifically for different wiring directions on each layer. For example, diagonal routes may have different dimensions than horizontal or vertical routes. This localized optimization improves manufacturing precision for each specific routing type while managing complexity through systematic differentiation.
Solution Approach 2:
The patent segments the routing system into distinct directional categories (horizontal, vertical, diagonal at 45 degrees, diagonal at 135 degrees), with each segment having its own optimized parameters for width and spacing. This segmentation allows precise control over manufacturing characteristics for each routing type while organizing complexity into manageable categories.
Data Source
AI summary
Some embodiments of the invention provide a process for designing and manufacturing an integrated circuit (“IC”). The process selects a wiring configuration and an illumination configuration. The process uses the selected wiring configuration to design an IC layout. The process then uses the selected illumination configuration to manufacture the IC based on the designed IC layout. Some embodiments select a wiring configuration based on the selected illumination configuration. In some embodiments, selecting the illumination configuration entails selecting at least one stepper lens for the IC layout, where the stepper lens illuminates at least one mask for at least one particular layer of the IC layout. Also, in some embodiments, selecting the wiring configuration entails defining the width and/or spacing of the routes along different directions on at least one particular wiring layer of the IC layout.