ICCES 3D Printed Ejection Head for MPICA
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Solution Overview
Problem
Current pick and place techniques for assembling electronic devices, such as RFID tags, are limited by low throughput, accuracy, and high costs, making them unsuitable for mass production of small die sizes required by the Internet of Things (IoT) applications.
Innovation Solution
The Integrated Circuit Controlled Ejection System (ICCES) uses 3D Printing/Etching to create a complex die retention and ejection system that allows for the precise and controlled ejection of hundreds of thousands of IC dies onto a substrate, enabling massively parallel integrated circuit assembly (MPICA) with high-resolution manufacturing and low production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional pick and place techniques are used for assembling electronic devices, then individual die placement can be achieved, but throughput is limited and costs are high
Solution Approach 1:
The system segments the assembly process into parallel operations by dividing the substrate into multiple zones with各自的 ejector arrays, allowing simultaneous placement of multiple die across different regions without increasing overall system complexity
Solution Approach 2:
The ejector pins serve multiple functions: they hold die in retention cavities during transport, position die precisely during placement, and can be selectively actuated for individual or mass ejection, replacing multiple separate mechanisms with a single multi-functional component
2Productivity
If mechanical pushpin systems are used for parallel IC assembly, then multiple die can be pushed in parallel, but the system is difficult and expensive to fabricate and not scalable to smaller dimensions
Solution Approach 1:
The patent replaces traditional mechanical pushpin systems with a vacuum-based retention system where ejector pins create vacuum chambers to hold die, allowing precise control at smaller dimensions without the fabrication difficulties of mechanical pushpin structures
Solution Approach 2:
The system changes the operational parameters of the ejector pins by using variable vacuum pressure levels to control die retention and release, enabling scalable operation from large to small die dimensions through parameter adjustment rather than structural redesign
3Productivity
If conventional assembly methods are used, then standard die sizes can be assembled, but ultra-high-volume assembly at low cost cannot be achieved
Solution Approach 1:
Die are pre-loaded into retention cavities in large quantities before the assembly process begins, allowing the system to operate in a continuous high-speed mode without frequent reloading, thereby achieving ultra-high-volume assembly at low cost
Solution Approach 2:
The system uses the substrate itself as part of the handling and positioning mechanism, where the substrate structure provides support and alignment features that eliminate the need for additional expensive positioning fixtures or tools
Data Source
AI summary
Methods, systems, and apparatuses are described for integrated circuit-controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA). A unique Integrated Circuit (IC) die ejection head assembly system is described, which utilizes Three-Dimensional (3D) Printing/Etching to achieve very high-resolution manufacturing to meet the precision tolerances required for very small IC die sizes.