ICE Core Deposition Uniformity via Dynamic Translation Stage
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Solution Overview
Problem
In thin film deposition processes, non-uniformities in thickness occur due to the flat nature of the substrate platen, leading to higher deposition rates at the center than at the edges, resulting in thinner layers on the edges.
Innovation Solution
A system and method that involves translating the position of a thermal source and/or a substrate holder during the deposition process, using ion-assisted electron beam deposition, and employing a planetary drive to move the substrate holder in multiple directions to ensure uniform deposition of integrated computational elements (ICE) Cores.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat substrate platen is used in thermal deposition, then the substrate holder is simple and easy to manufacture, but non-uniform thickness is created with higher deposition rates at the center than at the edges
Solution Approach 1:
The patent applies the dynamics principle by making the substrate holder movable relative to the evaporation source. The substrate holder is translated along the z-axis (vertical direction) during the deposition process, changing its position dynamically to compensate for the point source nature of the evaporation plume. This dynamic positioning ensures uniform deposition thickness across the entire substrate surface while maintaining the simplicity of the flat platen design.
2Productivity
If the center of the source is placed directly under the rotating substrate platen, then the deposition rate at the center is higher, but thinner layers are observed on the edges
Solution Approach 1:
The patent resolves this contradiction by dynamically adjusting the substrate holder position during deposition. The holder is translated along the z-axis to maintain optimal distance from the evaporation source throughout the deposition process, ensuring uniform material distribution across the substrate surface while preserving high deposition rates.
Solution Approach 2:
The patent applies parameter changes by varying the z-position of the substrate holder during the deposition process. This parameter adjustment (changing the distance between source and substrate) compensates for the radial distance variation and ensures uniform deposition thickness across the entire substrate area.
3Manufacturing precision
If a translation stage is used to move the substrate holder, then uniform deposition is achieved, but the device complexity increases
Solution Approach 1:
The patent implements a translation stage that moves the substrate holder along the z-axis during deposition. This dynamic positioning system, while adding some complexity, achieves uniform deposition thickness across the substrate surface by compensating for the point source evaporation plume geometry.
Solution Approach 2:
The patent replaces complex multi-axis positioning systems with a simpler single-axis (z-axis) translation stage. This mechanical substitution reduces the complexity of the deposition system while still achieving the goal of uniform deposition thickness across the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves uniformity in the deposition of ICE Cores by compensating for the point source nature of the evaporation plume, resulting in consistent layer thickness and density across the substrate, thereby improving the accuracy and reliability of the optical analysis devices.
Implementation Method 1
thermal deposition processes
Implementation Method 2
thin film deposition processes
Implementation Method 3
ion-assisted electron beam deposition
Implementation Method 4
ion-assisted electron beam deposition
Data Source
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AI summary
The disclosed embodiments include a system and method for manufacturing an integrated computational element (ICE) core. The method comprises varying a distance between a thermal component relative to a substrate holder that holds at least one substrate during a thin film deposition process to improve uniformity of the ICE core. In one embodiment, varying the distance between the thermal component relative to the substrate holder that holds at least one substrate includes moving at least a portion of the substrate holder in at least one direction relative to the thermal component and also moving the thermal component in at least one direction relative to the substrate holder during the thin film deposition process.