Inverted Cylindrical Magnetron With 3-Anode Field Uniformity
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Solution Overview
Problem
Conventional inverted cylindrical magnetron sources face challenges with non-uniform film deposition, high fabrication costs, limited substrate compatibility, and inadequate magnetic field tunability, which hinder precise stoichiometry control and high deposition rate applications.
Innovation Solution
A 3-anode configuration with a co-axial central anode and annular end anodes, combined with multi-zone electromagnets or hybrid electro-permanent magnets, provides electric field uniformity and tunable magnetic fields, along with advanced target temperature control and gas flow management, to enhance deposition uniformity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional ICM sources use metallic bonded target to copper tube, then target cooling is achieved, but fabrication cost increases significantly and operation temperature is limited
Solution Approach 1:
The patent replaces expensive metallic bonded targets with disposable, low-cost target materials that can be easily replaced. This eliminates the need for expensive copper tube bonding structures while maintaining effective cooling through the target support architecture, significantly reducing fabrication costs for applications where target replacement is acceptable.
Solution Approach 2:
The patent replaces the mechanical bonding system (metallic bonding between target and copper tube) with an alternative cooling architecture that uses the target support structure and gas flow management to achieve cooling without requiring high-temperature metallic bonds, thereby eliminating operation temperature limitations.
2Reliability
If conventional ICM sources use virtual anode along magnetic field lines, then electron-conducting path is provided, but electrical field uniformity deteriorates under high plasma impedance conditions
Solution Approach 1:
The patent introduces a physical anode structure as an intermediary element that provides a stable reference potential and ensures uniform electrical field distribution. This physical anode acts as a mediator between the plasma and the power supply, maintaining field uniformity even when plasma impedance varies, unlike the virtual anode approach that relies solely on magnetic field line geometry.
3Ease of manufacture
If conventional ICM sources use fixed magnetic field from permanent magnets, then magnetic field is provided, but target erosion uniformity and film deposition uniformity deteriorate
Solution Approach 1:
The patent replaces static permanent magnets with a dynamic electromagnetic field system that can be adjusted in real-time. This allows the magnetic field strength and distribution to be optimized during operation to achieve uniform target erosion and film deposition, transforming the magnetic field from a fixed parameter to a controllable process variable.
Solution Approach 2:
The patent enables continuous adjustment of magnetic field parameters (strength, distribution, geometry) to optimize deposition uniformity. By changing magnetic field parameters dynamically rather than relying on fixed permanent magnet configurations, the system achieves uniform target erosion and film deposition while maintaining ease of manufacture through electromagnetic actuators.
4Device complexity
If conventional ICM sources use single zone solenoid coil, then magnetic field is generated, but magnetic flux density uniformity along axial direction deteriorates
Solution Approach 1:
The patent divides the single zone solenoid coil into multiple independently controlled zones along the axial direction. Each zone can be adjusted to provide the appropriate magnetic flux density, enabling uniform overall field distribution. This segmentation transforms a simple but non-uniform coil into a slightly more complex but precisely controllable multi-zone system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves improved electric field uniformity, increased target utilization, and precise stoichiometry control, enabling higher deposition rates and longer target life, while reducing operational complexity and costs.
Implementation Method 1
a plurality of multi-zone electromagnets or hybrid electro-permanent magnets surrounding the exterior of the process chamber providing a tunable magnetic field
Implementation Method 2
The use of magnetron sputtering in the rapid deposition of metal films, reactively sputtered compound films and etching processes has found broad acceptance
Implementation Method 3
the first annular end anode, the second annular end anode, and the central anode form a 3-anode configuration to provide electric field uniformity
Data Source
AI summary
An Inverted Cylindrical Magnetron (ICM) System and Methods of Use is disclosed herein generally comprising a co-axial central anode concentrically located within a first annular end anode and a second annular end anode; a process chamber including a top end and a bottom end in which the first annular end anode and the second annular end anode are coaxially disposed, whereby the first annular end anode, the second annular end anode, and the central anode form a 3-anode configuration to provide electric field uniformity, and the process chamber including a central annular space coupled to a tube insulator disposed about the central annular space wall; a cathode concentrically coupled to the tube insulator and a target; and a plurality of multi-zone electromagnets or hybrid electro-permanent magnets surrounding the exterior of the process chamber providing a tunable magnetic field.