ICP Plasma Chamber Coating Layout for Low-Particle Processing
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Solution Overview
Problem
In plasma-based substrate treating apparatuses, the frequent collision of plasma with chamber walls in Inductively Coupled Plasma (ICP) systems leads to increased foreign matter generation and coating film damage, reducing chamber lifespan and film adhesion.
Innovation Solution
A substrate treating apparatus with a plasma chamber coated with yttrium fluoride (YF3) and yttrium oxide (Y2O3) films, where the YF3 film is applied on the chamber's upper and lower areas and the Y2O3 film on the central area, minimizing particle generation and thermal stress, and using an ICP antenna with power applied to one end and grounded at the other to control plasma flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a general coating film is applied to the inside walls of the plasma chamber, then foreign matter generation is minimized, but the coating film is easily damaged by heat stress and physical collision from plasma
Solution Approach 1:
The patent changes the material parameter of the coating film from conventional materials to yttrium fluoride (YF3), which has superior resistance to heat stress and physical collision from plasma. This material parameter change enables the coating film to withstand the harsh plasma environment while maintaining its protective function against foreign matter generation.
Solution Approach 2:
The patent employs a composite coating structure with multiple layers including yttrium fluoride (YF3) and yttrium oxide (Y2O3) films applied in specific patterns on the plasma chamber walls. This composite material approach combines the advantages of different materials to achieve both foreign matter reduction and enhanced durability against plasma damage.
2Productivity
If the plasma chamber is operated for extended periods, then productivity is improved, but the coating film detaches and chamber lifespan is reduced
Solution Approach 1:
The patent changes the chemical composition parameter of the coating film to yttrium fluoride (YF3) and yttrium oxide (Y2O3), which exhibit superior thermal stability and adhesion properties. This enables the chamber to operate continuously for extended periods without coating film detachment, thereby extending chamber lifespan while maintaining high productivity.
3Reliability
If yttrium fluoride (YF3) and yttrium oxide (Y2O3) coating films are applied to the plasma chamber, then coating film damage is minimized, but manufacturing complexity increases
Solution Approach 1:
The patent applies different coating materials (YF3 and Y2O3) to different locations or layers of the plasma chamber based on local requirements. This local quality approach optimizes coating film integrity in areas subject to different plasma conditions while maintaining a manageable manufacturing process through targeted application rather than uniform coating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces foreign matter generation, extends plasma chamber lifespan, and minimizes coating film damage and detachment, enhancing the apparatus's efficiency and longevity.
Implementation Method 1
An alternating current which flows through the antenna coil and generates the electric field inside the plasma reaction chamber
Implementation Method 2
The plasma collides with the chamber. The chamber is etched by colliding with the plasma
Implementation Method 3
The coating film minimizes a direct reaction between the plasma and the inside walls of the chamber
Implementation Method 4
The process gas supplied into the chamber is excited as the plasma by electromagnetic field generated in the chamber
Data Source
AI summary
Embodiments of the inventive concept provide a substrate processing apparatus. The substrate treating apparatus comprises a process treating unit providing a treating space performed treating the substrate; a plasma generating unit generating the plasma discharging a process gas, and supplying the plasma to the treating space. The plasma generating unit provides a plasma chamber having a generating space of the plasma; an antenna wound to surround the plasma chamber outside the plasma chamber; a first coating film covering inside walls of the plasma chamber and comprising yttrium fluoride (YF3).