ICP Coil Power Distribution for Uniform Substrate Plasma Treatment

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Solution Overview

Problem

Inductively Coupled Plasma (ICP) devices with single-output antennas face challenges in controlling plasma distribution uniformity and intensity, leading to structural complexity due to the need for separate devices to manage multiple output terminals.

Innovation Solution

A substrate processing apparatus with a single coil antenna and a power application unit that applies high-frequency power directly between the ends of the coil, utilizing a capacitor to adjust the power distribution ratio between the two ends, allowing for efficient plasma generation and distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single-output antenna structure is used, then the device structure is simple, but it is difficult to control the distribution of magnetic field and plasma in the processing space

Engineering Contradiction:
Improveantenna structureVSAvoidplasma distribution uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The single coil antenna is divided into two independent winding sections (first and second winding sections) with different numbers of turns. This segmentation allows each section to generate different magnetic field strengths, enabling control over plasma distribution in the processing space while maintaining a relatively simple single-coil structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the coil are designed with different numbers of turns to create localized variations in magnetic field intensity. The first winding section has a different number of turns compared to the second winding section, creating non-uniform magnetic field distribution that can be optimized for specific processing requirements.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If multiple coil antenna structures with independent output terminals are used, then plasma distribution can be controlled by independently adjusting magnetic field, but the device structure becomes complex

Engineering Contradiction:
Improveplasma distribution controlVSAvoidantenna structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Multiple winding sections that would traditionally require separate output terminals are merged into a single continuous coil structure. The first and second winding sections are connected in series, allowing independent control of magnetic field in different regions while maintaining a unified single-output antenna structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single coil antenna serves multiple functions: it generates the magnetic field for plasma generation, controls plasma distribution through differential winding sections, and maintains electrical continuity as a single output structure. The different winding sections enable both plasma generation and spatial distribution control within one component.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables efficient adjustment of plasma intensity and distribution, simplifying the antenna structure while maintaining uniformity and control over the plasma processing space.

Implementation Method 1

Inductively Coupled Plasma (ICP) devices convert the source material into plasma by using an induced electric field induced by a coil-shaped antenna

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

the first ground line or the second ground line may be provided with a capacitor

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS20250014867A1Substrate treatment apparatus and substrate treatment method
Publication Date: 2025.01.09 PSK INC
  • US20250014867A1 patent drawing
  • US20250014867A1 patent drawing
  • US20250014867A1 patent drawing

AI summary

The present invention provides an apparatus for treating a substrate. The apparatus for treating a substrate may comprise: a process treatment part which provides a treatment space where a substrate is treated; and a plasma source which generates plasma from process gas, wherein: the plasma source includes an antenna which has a coil wound in multiple turns, and a power application unit which applies high-frequency power to the coil; a first ground line is connected to one end of the coil and a second ground line is connected to the other end of the coil; and the power application unit is connected to the coil so as to apply high-frequency power directly to the coil at a position between one end and the other end of the coil.