Single-Layer ID Cover With Integrated Chip And Antenna

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Solution Overview

Problem

Existing personal identification document systems face challenges in integrating secure and compact transponder technology due to varying data capture standards and the need for enhanced security, particularly in making data retrieval contactless and robust.

Innovation Solution

A single-layer cover structure with a recess for a thin chip module and an integrated antenna, where the chip module is inlaid and the antenna is connected, allowing for robust and cost-effective production without additional supporting layers, using materials like cotton, paper, or plastics to ensure protection and longevity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional identity card with a transponder is provided to achieve dual identification systems, then contactless data retrieval is enabled, but additional supporting layers are required which increase cover thickness and reduce robustness

Engineering Contradiction:
Improvecontactless data retrieval capabilityVSAvoidnumber of supporting layers
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the antenna and chip module directly into the single-layer cover structure, eliminating the need for separate supporting layers. The antenna is printed directly on the cover's rear side, and the chip module is mounted on the antenna, integrating multiple functions into one unified structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The cover serves multiple functions: it acts as the protective cover for the personal identification document, the substrate for the antenna, and the mounting structure for the chip module. This multi-functionality eliminates the need for additional supporting layers while maintaining all required capabilities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If additional supporting layers are added to accommodate the transponder, then the chip module can be mounted, but the cover thickness increases and robustness decreases

Engineering Contradiction:
Improvechip module mounting capabilityVSAvoidcover thickness
Core Design Contradiction:
Ease of manufactureVSLength of stationary object

Solution Approach 1:

The cover and the transponder substrate are merged into a single structure. The antenna is printed directly on the cover's rear side, and the chip module is mounted on this integrated structure, eliminating the need for additional supporting layers and reducing overall thickness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent uses a thin, flexible single-layer cover that directly supports the antenna and chip module. This thin-film approach maintains structural integrity while minimizing thickness, avoiding the need for bulky multi-layer constructions.

Inventive Principle:
Principle #30Flexible shells and thin films

3Duration of action of stationary object

If the chip module is integrated into the cover, then service life is extended, but protection from external influences must be enhanced

Engineering Contradiction:
Improveservice lifeVSAvoidexternal influences
Core Design Contradiction:
Duration of action of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The chip module is nested within a recess in the cover, and the antenna is printed on the rear side of the cover. This nested arrangement protects the chip module from external influences while maintaining a compact, integrated structure that extends service life.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The single-layer cover acts as a protective shell that encloses and protects the antenna and chip module from external factors such as moisture, dust, and physical damage, while maintaining flexibility and durability for extended service life.

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentUS8684273B2Cover structure with integrated chip and antenna
Publication Date: 2014.04.01 INFINEON TECHNOLOGIES AG
  • US8684273B2 patent drawing
  • US8684273B2 patent drawing

AI summary

In various embodiments, a cover structure for a personal identification document is provided. The cover structure may include a cover formed as a single layer; a chip module; the cover having a recess for completely receiving the chip module; and an antenna that is connected to the chip module.